34th International Workshop on Vertex Detectors

Session

New Developments

24 Jul 2026, 09:00

Conveners

New Developments

• Stefano Terzo (IFAE Barcelona (ES))

New Developments

• Martin Kocian (SLAC National Accelerator Laboratory (US))

90. Recent developments in Allpix Squared

Naomi Davis (ATLAS)

24/07/2026, 09:00

Oral

The Allpix Squared Simulation Framework is a versatile, open-source simulation framework for semiconductor pixel detectors. Its eases the implementation of detailed simulations for single sensors as well as more complex structures with multiple detectors, and small experiments. Over the past decade, it has been used in many projects in high-energy physics as well as medical imaging,...

55. Progress of SiC and GaN as particle detector

Xin Shi (Chinese Academy of Sciences (CN))

24/07/2026, 09:20

Oral

Wide band-gap (WBG) semiconductors such as SiC and GaN are desirable material for charged particle spectroscopy in high temperature, high radiation environments. SiC PIN, Schottky and LGAD devices have been fabricated in the past few years. Detector response such as spatial and temporal resolution at higher temperatures and irradiation environments have been investigated by several groups. For...

56. Progress in 3D Diamond detector characterisation and design

Alexander Oh (The University of Manchester (GB))

24/07/2026, 09:40

Oral

3D diamond detectors for ionising radiation can be produced with femto-second laser systems and beam shaping techniques, allowing feature sizes of micron precision inside the bulk diamond.
Diamond is a proven radiation hard material, while the 3D electrode geometry reduces the drift length to produce a signal and this enhances the detector tolerance to radiation damage.
We report about the...

95. Quantum sensors for forward detectors

Ben Kilminster (University of Zurich (CH))

24/07/2026, 10:30

Oral

33. Modern interconnection technologies for pixel detectors

Fabian Huegging (University of Bonn (DE))

24/07/2026, 10:50

Oral

In this presentation an overview of interconnection technologies for hybrid pixel detectors as used in HEP experiments is given. Since more than twenty years the classical fine-pitch bump bumping with solder (SnAg, Cu pillars) and indium with pitches down to 50 µm or below is the state-of-art technology for hybrid pixel detectors in use for example at all LHC and HL-LHC experiments. But since...

27. NEUROPix: Spiking Neural Networks fo pixel detector data processing

Mathieu Benoit (Oak Ridge National Laboratory (ORNL))

24/07/2026, 11:10

Oral

Advances in edge computing for future high energy physics experiments, electron microscopy, and neutron imaging demand state of the art hardware and software solutions. Modern experimental environments require rapid data handling and real time processing, including precise and consistent particle identification and characterization at nanosecond timescales. The high data rates typical of these...

26. Smart pixels: on-chip data reduction with machine learning

Jennet Elizabeth Dickinson (Cornell University (US))

24/07/2026, 11:30

Oral

High-granularity pixel detectors at the LHC and beyond must operate in extreme collision environments and satisfy stringent constraints on power consumption and read-out bandwidth. Current-generation pixel detectors produce too much data to read out for every collision, and the future experiments will face even bigger challenges due to smaller pixel pitch and more complex beam backgrounds....