TWEPP26 Topical Workshop on Electronics for Particle Physics

Session

Integration

29 Sept 2026, 11:20

Castelldefels, Barcelona, Spain

40. Service and power electronics for ALICE ITS3.

Olivier Bourrion (Centre National de la Recherche Scientifique (FR))

29/09/2026, 11:20

Power - Power, Grounding and Shielding

Oral

For LHC Run 4, ALICE will use stitched Monolithic Active Pixel Sensors (MAPS) to upgrade its Inner Tracking System (ITS3). The detector will require detector service electronics (DSE) to provide and monitor power supplies, forward clock and timing information, enable remote sensor configuration and monitoring, and convert copper 10 Gb/s serial data links to optical links. Installed within 30...

107. First in-home hybridization of IGNITE ROCs on 3D silicon sensors using ACF bonding: tests and results

Angelo Loi (Universita e INFN, Cagliari (IT))

29/09/2026, 11:40

Integration - Integration, Packaging and Interconnects

Oral

The development of hybrid silicon pixel sensors for High-Luminosity LHC experiments is entering a critical prototyping phase. The INFN IGNITE project aims to deliver next-generation 4D tracking readout chips (ROCs) featuring an intrinsic time resolution of σ < 50 ps per pixel. Recent milestones include the debut of IGNITE-64 and IGNITE-32 ROCs, supporting 4096 and 1024 channels, respectively....

96. Design and testing of hybrid-flex and readout-flex for LHCb UP detector

Hanbing Liu (Lanzhou University (CN))

29/09/2026, 12:00

Integration - Integration, Packaging and Interconnects

Oral

The LHCb Upgrade II, scheduled for the 2030s at HL-LHC, encounters extreme pileup, placing stringent demands on high-performance tracking. The Upstream Pixel Tracker (UP) is essential for precise reconstruction upstream of the magnet, with strict constraints on low material budget and long-range 1.28 Gb/s high-speed data transmission.

In this presentation I will introduce the UP layout and...