The 2026 ECFA-DRD3/DRD7 Workshop on 3D Integration Technologies provides a forum to discuss recent progress, emerging concepts, and future opportunities in advanced packaging, wafer-level integration, and low-mass module technologies for semiconductor detectors at future collider experiments.
The Workshop brings together experts from the high-energy physics community and industry to review ongoing developments in 3D integration, wafer-to-wafer bonding, hybrid bonding, interconnect technologies, silicon interposers, and advanced detector-module assembly techniques.
The morning session focuses on applications and R&D progress in the detector community, highlighting progress and perspectives from ongoing DRD3-WG7 and DRD7.6b projects.
The afternoon session is dedicated to industrial perspectives, advanced technological solutions, and specialised equipment relevant to 3D integration and next-generation detector-module fabrication.
Direct Zoom-connection link: https://cern.zoom.us/j/61031939483?pwd=DZnO2ucX0wAIhSYSc3Cs9QYkn0FUNY.1