3-14 June 2013
CERN
Europe/Zurich timezone

Micro integration of electronics - from bump bonding to 3D stacking

Jun 3, 2013, 10:00 AM
45m
40/S2-C01 - Salle Curie (CERN)

40/S2-C01 - Salle Curie

CERN

30
Show room on map

Speaker

Thomas Fritzsch (Fraunhofer IZM)

Presentation materials