TALENT Summer School

Name: TALENT Summer School
Start: 2013-06-03T09:00:00+02:00
End: 2013-06-14T12:01:00+02:00
Location: CERN

3–14 Jun 2013

CERN

Europe/Zurich timezone

Micro integration of electronics - from bump bonding to 3D stacking

3 Jun 2013, 10:00

45m

40/S2-C01 - Salle Curie (CERN)

115

Work Package 2: Sensors and Work Package 3: Electronics

Thomas Fritzsch (Fraunhofer IZM)

Slides

2013-06-03_Fraunhofer_IZM_3D_WLP.pdf