Front End Electronics (FEE 2014)

Session

3D Integration Session II

21 May 2014, 15:45

Energy Sciences Building (Argonne National Laboratory)

Conveners

3D Integration Session II

• Takaki Hatsui (RIKEN)

25. Towards a 3D AGIPD

Alessandro Marras (Deutsches Elektronen-Synchrotron)

21/05/2014, 15:45

26. 3D CMOS Sensors with Two Layers in the 180nm Tower/Jazz Process

Wojciech Dulinski (Institut Pluridisciplinaire Hubert Curien (FR))

21/05/2014, 16:10