Speaker
Mauro Dinardo
(Universita & INFN, Milano-Bicocca (IT))
Description
The high luminosity phase of the Large Hadron Collider (HL-LHC) requires a major pixel detector R&D effort to develop both readout chip and sensor that are capable to withstand unprecedented extremely high radiation damage. The target integrated luminosity of 3000 fb-1, that the HL-LHC is expected to deliver over about 10 years of operation, translates into a hadron fluence of 2x10^16 1MeV eq. n / cm2 at about 3 cm from the interaction region where the first layer of the pixel detector could be located, and to a radiation dose of 10 MGy for the readout chip. The CMS collaboration has undertaken two baseline sensor R&D programs on thin n-in-p planar and 3D Silicon sensor technologies. Alternative technologies are also being investigated such as polycrystalline Diamond and HV-CMOS. Status, progresses, and prospects of this effort will be discussed.
Primary author
Mauro Dinardo
(Universita & INFN, Milano-Bicocca (IT))
