10th Anniversary "Trento" Workshop on Advanced Silicon Radiation Detectors

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Non HEP projects

Planar Sensor 1

Introduction

HV CMOS (2) and LGAD (1)

HV CMOS 1

LGAD (2)

Planar Sensors 2

3D Sensors 1

3D Sensors 2

TCAD Simulations

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Contributions*

Analog circuit design in 65 nm CMOS for the readout of silicon pixel detectors (in session "Introduction")

Applications of Atomic Layer Deposition (ALD) on ultra-fine pitch pixel detectors (in session "Planar Sensor 1")

Beamtests of HPK/KEK n$^+$-in-p pixel sensors for ATLAS HL-LHC upgrade inner tracker (in session "Planar Sensors 2")

Capacitively Coupled Hybrid Pixel Assemblies for the CLIC Vertex Detector (in session "HV CMOS (2) and LGAD (1)")

CMS Silicon Strip Tracker Readiness for LHC Run II (in session "Planar Sensor 1")

Design and TCAD simulation of a new generation of 3D Sensors for HL-LHC within the INFN (ATLAS-CMS) R&D program in collaboration with FBK (in session "3D Sensors 2")

Design of planar p-on-n pixel sensor with an optimized active-edge region for the next generation of FELs (in session "TCAD Simulations")

Determination of the Doping profile of LGAD detector (in session "LGAD (2)")

Development of a gamma-blind neutron-efficient detector using silicon detectors and a reactive lithium film. (in session "Non HEP projects")

Development of a new technology for the next generation of 3D Pixel Sensors for HL-LHC within the INFN (ATLAS-CMS) R&D program in collaboration with FBK. (in session "3D Sensors 2")

Development of thin n-in-p planar pixel modules for the ATLAS upgrade at HL-LHC (in session "Planar Sensor 1")

Doping profiles and radiation damage (in session "TCAD Simulations")

Electric field and mobility in extremely irradiated silicon (in session "Introduction")

Experience with 3D in ATLAS IBL (in session "3D Sensors 1")

First concepts for 3D radiation detector manufacturing at CiS (in session "3D Sensors 2")

First silicon tracking system prototype with artificial retina for fast track finding (in session "Planar Sensor 1")

HVCMOS Sensors for LHC Upgrade (in session "HV CMOS 1")

Identification of nuclear fragments using digitized signals from a partially depleted Si detector (in session "Non HEP projects")

Industrial production of silicon strip sensors with Infineon (in session "Planar Sensor 1")

Initial acceptor removal in p-type silicon detectors (in session "LGAD (2)")

Investigation of long-term operation of charge multiplication sensors (in session "LGAD (2)")

Investigation of the Electrical Characteristics of Double-Sided 3D Sensors after Proton and Neutron Irradiation up to HL-LHC Fluencies (in session "3D Sensors 1")

Issues in the design of Ultrafast silicon detectors (in session "HV CMOS (2) and LGAD (1)")

Laboratory characterization of CCPDv2 and CCPDv4 capacitively coupled to FEI4 (in session "HV CMOS 1")

Last fabrication run of LGAD detectors at CNM-CSIC. (in session "LGAD (2)")

Latest development of HPK/KEK n$^+$-in-p planar pixel sensor modules for HL-LHC and understanding their performance with TCAD simulations (in session "Planar Sensors 2")

Measurements of the Time Resolution of Low-Gain Avalanche Detectors (LGAD) (in session "HV CMOS (2) and LGAD (1)")

Measures with strips LGAD p-type detectors fabricated at CNM-Barcelona (in session "HV CMOS (2) and LGAD (1)")

New 3D fabrication at CNM-Barcelona for pixel ATLAS upgrade (in session "3D Sensors 2")

New developments in high-density SiPM technology at FBK (in session "Non HEP projects")

Numerical simulation of Low Gain Avalanche Detectors (in session "LGAD (2)")

Preliminary results from the first batch of Si 3D sensors fabricated at FBK on 6 inch wafers (in session "3D Sensors 1")

Registration

Results on FBK 3D pixel detectors for CMS (in session "3D Sensors 1")

Simulation and testing of thin silicon microdosimeters realized with planar technology (in session "Non HEP projects")

SPS Test Beam characterization results with CCPDv2 and CCPDv4 capacitively coupled to FEI4 (in session "HV CMOS 1")

Status of 3D silicon pixel detectors for the ATLAS Forward Physics experiment (AFP) (in session "3D Sensors 1")

Status of single-sided 3D detector development at SINTEF (in session "3D Sensors 2")

Status of the proton Computed Tomography project developed within the RDH INFN experiment (in session "Non HEP projects")

Studies and status of CMOS-based sensors research and development for ATLAS strip detector upgrade (in session "HV CMOS 1")

Studies of non-irradiated and irradiated HVCMOS detectors (in session "HV CMOS (2) and LGAD (1)")

Study of signal saturation in LGAD sensors (in session "LGAD (2)")

Surface effects in segmented silicon sensors (in session "Introduction")

TCAD Simulation of HVCMOS sensors (in session "HV CMOS 1")

TCAD Simulations of Radiation Damage Effects at High Fluences in Silicon Detectors with Sentaurus TCAD (in session "TCAD Simulations")

Test beam data analysis of ATLAS planar pixel sensor with alternative bias rail geometries. (in session "Planar Sensors 2")

Test Beam Results of a 3D Diamond Detector (in session "3D Sensors 2")

The RD53 programme and the CHIPIX65 / INFN project for the development of pixel readout chip for extreme rate and radiation (in session "TCAD Simulations")

Vertigo, a vertically integrated heterogeneous microsystem (in session "Non HEP projects")

Welcome (in session "Introduction")

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Events scheduled on*

17/02/2015

18/02/2015

19/02/2015

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