17–19 Feb 2015
FBK, Trento
Europe/Zurich timezone

Session

Planar Sensors 2

18 Feb 2015, 14:20
"Stringa" Conference Hall (FBK, Trento)

"Stringa" Conference Hall

FBK, Trento

Via Sommarive, 18 38123 Povo - Trento ITALY

Conveners

Planar Sensors 2

  • Gianluigi Casse (University of Liverpool (GB))

Presentation materials

There are no materials yet.

  1. Clara Nellist (LAL-Orsay (FR))
    18/02/2015, 14:20
    It is known that for the current design of planar pixel sensors, there is a drop of efficiency at the punch-through structure of the biasing system at the edge of pixels. Various geometries, as part of the ATLAS Inner Tracker (ITK) upgrade, are being investigated to reduce this inefficiency. A planar pixel sensor with multiple alternative bias rail geometries has been tested at the SPS beam...
  2. Daiki Yamaguchi (Tokyo Institute of Technology (JP))
    18/02/2015, 14:40
    ATLAS upgrade for foreseen High Luminosity LHC will require the high radiation tolerance on Pixel Detector. The n$^{+}$-in-p silicon technology is a promising candidate for the pixel upgrade, due to its radiation hardness and cost effectiveness. We have developed n$^{+}$-in-p planar pixel sensors produced by HPK (Japan) connected by bump bonding to the ATLAS read out chip FE-I4. The new...
  3. Yoshinobu Unno (High Energy Accelerator Research Organization (JP))
    18/02/2015, 15:00
    We have been developing planar-process pixel sensors in p-type 6-in. silicon wafer for an application in ATLAS detector for the luminosity upgrade of the large hadron collider (HL-LHC). Our motivation is to develop a highly radiation-tolerant and cost-effective pixel sensor for covering large area of the pixel detector. In the 1st prototype pixel sensors, after irradiation and beamtest,...
Building timetable...