Speaker
Joern Lange
(IFAE Barcelona)
Description
3D silicon detectors, in which the electrodes penetrate the sensor bulk
perpendicular to the surface, have recently undergone a rapid development from R&D
over industrialisation to their first installation in a real HEP experiment. Right
now the ATLAS Insertable B-Layer (IBL) is taking first collision data with 3D pixel
detectors. At the same time, preparations are advancing to install 3D pixel
detectors in forward trackers such as the ATLAS Forward Proton (AFP) detector,
which might be installed as early as the end of this year, or the CMS-TOTEM PPS.
For those experiments, the main requirements are a slim edge and the ability to
cope with non-uniform irradiation. Both has been shown to be fulfilled by 3D pixel
detectors. For the HL-LHC pixel upgrades of the major experiments (ATLAS, CMS,
LHCb), 3D detectors are a promising candidate for the innermost pixel layers to
cope with harsh radiation environments up to fluences of 2e16 $n_{eq}/cm^2$ thanks to
their excellent radiation hardness at low operational voltages and power
dissipation and moderate temperatures. This presentation will give an overview on
the recent developments of 3D detectors related to these projects and the future
plans.
Primary author
Joern Lange
(IFAE Barcelona)
