11th Workshop on Electronics for LHC and future Experiments

Session

Plenary session P3

P3

14 Sept 2005, 09:00

Heidelberg

Description

The whole of Wednesday will be devoted to hybrids. We propose a more interactive workshop session with both talks and discussion interspersed, so the agenda should be treated as a guide. It will be updated with more details.

114. Electronics Packaging Development A never ending challenge

Mr Stefano Oggioni (IBM Vimercate)

14/09/2005, 09:00

There is an increased awareness in the semiconductor industry that packaging technology is an essential and integral part of the semiconductor product, and has become a critical competitive factor in many market segments since it affects operating frequency, power, reliability and costs. Costs pressure over System development investments has created a strong demand in the industry...

106. State of the art design of rigid-flex substrates – A manufacturer’s point of view

Mr Daniel Puschmann (GS Praezisions AG), Dr Frank Bose (GS Praezisions AG)

14/09/2005, 09:45

Oral

GS Praezisions AG has been involved in the LHC project by providing electronic substrates for several experiments such as the CMS front-end hybrids, CMS Calorimeter, ALICE Silicon Pixel Detector MCM and others. Based on the experience with the designs of the various groups and countries we will highlight the common mistakes, opportunities and challenges in modern PCB design. We...