TS Workshop

Session

Technology

5 May 2004, 14:00

Archamps

40. Introduction to the session

Benvenuti, C.

05/05/2004, 14:00

43. FABRICATION DES CIRCUITS HAUTE DENSITE ET AUTRES CIRCUITS SPECIAUX

De Oliveira, R.

05/05/2004, 14:10

En marge de la fabrication standard de circuits imprimes, nous avons realise durant l'annee 2003, en collaboration avec differents groupes de recherche, certains composants specifiques a l'etude de la physique des particules des hautes energies (detecteurs de particules et circuits electroniques exposes a de tres forts taux de radiations). Pour comprendre la particularite de ces composants,...

44. DISTURBANCES AND POWER QUALITY OF CERN'S ELECTRICAL NETWORK

Kahle, K.

05/05/2004, 14:30

This paper gives an overview of most the common disturbances and power quality problems in CERN’s electrical network and explains their consequences for accelerator operation. Based on detailed statistics, the quantitative parameters of network disturbances at CERN are presented and immunity levels for user’s electrical equipment proposed in order to minimise the number of accelerator problems...

45. SPECIAL COATINGS FOR THE LHC

Calatroni, S.

05/05/2004, 14:50

Several LHC components require a thin film coating. These coatings fall in two main categories, namely NEG coatings to improve the vacuum behaviour of chambers or conductive coatings to decrease the surface impedance of components. Examples of the first category are the intersection vacuum chambers of the different experiments, where the required vacuum can be obtained only with a NEG coating...

46. TECHNIQUES DE CONTRÔLES NON DESTRUCTIFS

Dalin, J.M.

05/05/2004, 15:10

La construction du LHC et des expériences nécessite un contrôle permanent de la qualité de la matière première utilisée et des assemblages par soudage, brasage ou collage des divers composants. Pour la vérification des matériaux et des assemblages de fabrication, il est souvent hors de question de recourir à des méthodes qui altéreraient les parties à contrôler. Les techniques de Contrôles Non...

47. COFFEE BREAK

05/05/2004, 15:30

48. TECHNIQUES DE FORMAGE ET D’ASSEMBLAGE

Favre, G. , Mathot, S.

05/05/2004, 15:50

Les sections Techniques d’Assemblage du groupe EST/MF et Brasage du groupe EST/SM ont été groupées en un seul service dans un but de rationalisation accrue des ressources et méthodes. Ce service dispose de nombreux moyens : soudure et découpe LASER (YAG, 350 W), soudure par faisceau d’électrons (deux installations, 35 et 7.5 kW), équipements TIG orbital, jet line, MIG, soudure plasma, boîte à...

49. AN APPLICATION OF POWDER METALLURGY FOR THE LHC

Sgobba, S.

05/05/2004, 16:10

The cold mass of the 1232 superconducting dipole magnets of LHC, operating at 1.9 K, is enclosed by a shrinking cylinder and two end covers at its extremities. The covers are structural components that must retain high strength and toughness at cryogenic temperature. They are manufactured by Metso Oy /FI in AISI 316 LN steel by Powder Metallurgy (PM) and Hot Isostatic Pressing. PM represents...

50. MATERIAL STUDIES FOR CLIC RF CAVITIES

Taborelli, M.

05/05/2004, 16:30

Following the EST/SM suggestion of replacing copper by molybdenum or tungsten for the construction of the RF cavity irises, different CLIC main beam accelerating structures were produced, extensively operated and disassembled for iris surface inspection. The observed surface modifications were found to be very similar to those obtained by sparking in a dedicated laboratory set-up, showing the...

41. MICROMETRIC ALIGNMENT METROLOGY: MEANS, DEVELOPMENTS AND APPLICATIONS

Mainaud Durand, H.

05/05/2004, 16:50

PIn order to meet the ever-increasing drastic alignment tolerances concerning the future particle accelerators, a new generation of sensors has been developed. Whether they are based on ultrasonic, optical or capacitive technology, these sensors, of micrometric resolution, allow continuous measurements in an often hostile environment (strong radiations, strong electro-magnetic fields) and...

42. Conclusions

Benvenuti, C.

05/05/2004, 17:10