10th International Meeting on Front-End Electronics (FEE 2016)

Session

3D integration

1 Jun 2016, 14:00

AGH University of Science and Technology

Conveners

3D integration

• Piotr Maj (AGH UST)

34. The 3D digital SiPM for nEXO

Jean-Francois Pratte (Universite de Sherbrooke)

01/06/2016, 14:00

36. 3D integration technology – status

Grzegorz Deptuch (Fermi National Accelerator Lab. (US))

01/06/2016, 14:25

38. VIPIC-Large 3D pixel readout for XPCS

Farah Fahim (Fermi National Accelerator Lab. (US))

01/06/2016, 14:50