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RoodMicrotec works with customers on the development of ASICs according to customers’ specifications, subcontracts the ‘wafer’ production and packaging, tests and qualifies the ASICs’ functionality. The company operates globally, but most of its operations are centred in Europe.
RoodMicotec's services across wafer, package IC, printed board assembly, printed circuit board and interconnection technology (soldering, gluing, crimping) cover: