AIDA-2020 Second Annual Meeting

Session

WP4 Micro-electronics and interconnections

6 Apr 2017, 09:00

Amphi Charpak (LPNHE)

Conveners

WP4 Micro-electronics and interconnections: Micro-electronics and interconnections

• Valerio Re (INFN)
• Valerio Re (Universita e INFN, Pavia (IT))
• Christophe De La Taille (OMEGA (FR))

WP4 Micro-electronics and interconnections: Micro-electronics and interconnections

• Christophe De La Taille (OMEGA (FR))
• Valerio Re (Universita e INFN, Pavia (IT))
• Valerio Re (INFN)

386. Introduction

Valerio Re (Universita e INFN, Pavia (IT))

06/04/2017, 09:00

375. Design and submission of the RD53A chip

Luigi Gaioni (Universita e INFN, Pavia (IT))

06/04/2017, 09:10

376. AIDA/RD53 activities in Perugia

Sara Marconi (INFN and University of Perugia (IT)), sara marconi

06/04/2017, 09:30

377. The CHIPIX65 demonstrator chip

Lino Demaria (Universita e INFN Torino (IT))

06/04/2017, 09:45

378. Update on CPPM activities towards development in 65nm

Alexandre Rozanov (CPPM, Aix-Marseille Université, CNRS/IN2P3 (FR)), Mohsine Menouni (Centre National de la Recherche Scientifique (FR))

06/04/2017, 10:00

379. Update on 65nm developments in Bonn

Hans Krueger (University of Bonn)

06/04/2017, 10:15

380. A high precision TDC for CMS MG-RPC in TSMC130n

Herve Mathez (Universite Claude Bernard-Lyon I (FR))

06/04/2017, 11:00

381. developments at OMEGA and DESY/Heidelberg

Nathalie Seguin-Moreau (OMEGA - Ecole Polytechnique - CNRS/IN2P3)

06/04/2017, 11:15

382. developments at AGH Krakow

Marek Idzik (AGH University of Science and Technology (PL))

06/04/2017, 11:30

383. discussion on 130 nm WP4.3

06/04/2017, 11:45

384. TSV developments at UBonn

Fabian Huegging (University of Bonn), Fabian Huegging (Universitaet Bonn (DE))

06/04/2017, 12:00

385. TSV developments in Glasgow

Richard Bates (Department of Physics and Astronomy-University of Glasgow), Richard Bates (University of Glasgow (GB))

06/04/2017, 12:15