Validation and Reliability Tests for the new VFC-HD

• Volker Schramm (Universitaet Stuttgart (DE))

Room: 866/2-D05 The new VFC HD was developed as a general purpose acquisition card for various systems in BI. During and after PCB production, a variety of tests are put in place to assure correct functionality and reliability. Using a climatic chamber, a subset of cards are subjected to temperature and humidity cycling as well as a high temperature test to define the environmental tolerances and to trigger possible failure mechanisms. This also involves the FMC mezzanine slot as well as commercial SFP+ transceiver modules. All of the 1,150 cards produced so far have passed selected component testing and X-ray camera inspection before a final functional test at the manufacturer. After reception at CERN the cards are screened for early failures by performing burn in at elevated stress conditions followed by a run in. The validation results and the current status of the screening will be presented.