TREDI2020: 15th "Trento" Workshop on Advanced Silicon Radiation Detectors

Session

3D Sensors

19 Feb 2020, 09:00

TU the Sky (TU Wien)

Conveners

3D Sensors

• Gian-Franco Dalla Betta (INFN and University of Trento)

3D Sensors

• Gian-Franco Dalla Betta (INFN and University of Trento)

34. Performance and prospects of the PPS tracking system.

Andrea Bellora (Universita e INFN Torino (IT))

19/02/2020, 09:00

HEP Systems

contributed talk

The CMS-TOTEM Precision Proton Spectrometer (PPS) consists of tracking and timing detectors installed along the LHC beam line between 210 and 220 m from the interaction point on both sides of the CMS experiment. The aim of the apparatus is to measure the position, direction and time-of-flight of protons which emerge intact from the pp collision. Fully integrated in the CMS data acquisition...

30. Results on 3D Pixel Sensors for the CMS Inner Tracker Upgrade at the High Luminosity LHC

Antonio Cassese (INFN, Firenze (IT))

19/02/2020, 09:20

hybrid sensors (3D, LGAD)

contributed talk

The High Luminosity upgrade of the CERN Large Hadron Collider (HL-LHC) will require new high-radiation tolerant silicon pixel sensors, capable of withstanding, in the innermost tracker layer, fluences up to $2.3\times 10^{16} n_{eq}/cm^2$ (1MeV equivalent neutrons). An extensive R&D program aiming at 3D pixel sensors, built with a top-side only process, has been put in place in CMS. A few...

52. Characterization of FBK 3D pixel sensor modules based on RD53A readout chip for the ATLAS ITk

Md Arif Abdulla Samy (Universita degli Studi di Trento and INFN (IT))

19/02/2020, 09:40

hybrid sensors (3D, LGAD)

contributed talk

3D pixel sensors are the technology of choice for the innermost layer (L0) of the ATLAS ITk detector at High Luminosity LHC. The considered sensors have pixel size of either 25 um x 100 um or 50 um x 50 um, with one read-out electrode at the center of a pixel and four bias electrodes at the corners. The former geometry has been chosen for the central part of L0 (barrel), the latter for the...

35. Study of 3D pixel sensors after non-uniform proton irradiation

Dr Jordi Duarte Campderros (Universidad de Cantabria and CSIC (ES))

19/02/2020, 10:00

hybrid sensors (3D, LGAD)

contributed talk

The Phase-II upgrade of the inner tracker of the CMS experiment is considering to use 3D pixel sensors for the innermost layers, given their intrinsic properties, well suited to resist the extreme radiation fluences expected at the High Luminosity Large Hadron Collider (HL-LHC). In this talk we present data collected from beam tests of 3D sensors bump-bonded to the RD53A prototype readout...

49. Preliminary results from the latest production of 3D pixel detectors at SINTEF MiNaLab

Dr Marco Povoli (SINTEF MiNaLab)

19/02/2020, 10:20

hybrid sensors (3D, LGAD)

contributed talk

SINTEF MiNaLab recently completed its fifth fabrication run of full 3D pixel detectors with active-edges. The sensors were designed by the University of Oslo in collaboration with SINTEF within the Norwegian 3D detector collaboration. Sensors were fabricated on 6", Si-Si bonded wafers, with a device layer thickness of 150µm, using a single-sided processing approach. The production run included...

16. Performance of 3D-trench silicon sensors designed for high time resolution

Maria Margherita Obertino (Universita e INFN Torino (IT))

19/02/2020, 11:20

hybrid sensors (3D, LGAD)

contributed talk

Developments on future tracking detectors go in the direction of a full 4D approach, in the sense of having both space and time measuring capabilities at the single pixel level. This is strongly motivated by the extremely high interaction intensities foreseen in the collider experiments of the next couple of decades and possibly beyond. Presently, no satisfactory technical solutions are...

25. Timing resolution on a 3D silicon pixel detector

Dario De Simone (Universitaet Zuerich (CH))

19/02/2020, 11:40

hybrid sensors (3D, LGAD)

contributed talk

We report the measurements of time resolution for double-sided 3D pixel sensors with a single cell of 50 {\mu}m x 50 {\mu}m fabricated at IMB-CNM. Measurements were conducted using a radioactive source at -20 and 20 degrees C in a bias voltage range of 50-200 V. The reference time was provided from an LGAD detector produced by Hamamatsu. Results are compared to previous measurements on...

58. Performance of CNM 3D pixel sensors irradiated up to 1e16 n_{eq}/cm^{2}

Stefano Terzo (IFAE Barcelona (ES)), Sebastian Grinstein (IFAE - Barcelona (ES))

hybrid sensors (3D, LGAD)

contributed talk

The ATLAS experiment at LHC will replace its inner tracker system to cope with the extreme particle fluence expected with the High Luminosity upgrade of the accelerator (HL-LHC). The innermost layer of the new Inner Tracker (ITk) will be instrumented with 3D silicon sensors. This technology allows to decouple the active thickness and the inter-electrode distance effectively improving the...