Session

CMOS

18 Feb 2020, 09:00
TU the Sky (TU Wien)

TU the Sky

TU Wien

Getreidemarkt 9, 1060 Wien (11th floor, BA building)

Conveners

CMOS

  • Nanni Darbo (INFN e Universita Genova (IT))

CMOS

  • Nanni Darbo (INFN e Universita Genova (IT))

CMOS

  • Gian-Franco Dalla Betta (INFN and University of Trento)

Presentation materials

There are no materials yet.

  1. Norbert Wermes (University of Bonn (DE))
    18/02/2020, 09:00
    Monolithic Sensors (CMOS)
    invited talk

    The development of radiation hard, depleted monolithic active pixel sensors (DMAPS) over many years has led to full size detector matrices, realised in LFoundry 150 nm and TowerJazz 180 nm technologies.
    Large and small electrode designs have been investigated and characterised, with different readout schemes, in a collaboration between Bonn-CERN-CPPM-IRFU. The talk will present the results of...

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  2. Roberto Cardella (University of Oslo (NO))
    18/02/2020, 09:40
    Monolithic Sensors (CMOS)
    contributed talk

    The MALTA (Monolithic pixel sensor from ALICE To ATLAS) is a monolithic silicon pixel sensor that has been designed in the 180 nm CMOS imaging process of TowerJazz. It was designed to be compatible with conditions like in the outermost pixel layer of the ATLAS ITk High Luminosity upgrade, with a required radiation hardness up to a fluence of $1\times 10^{15}\,n_{eq}/cm^2$ and a TID of...

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  3. David-Leon Pohl (University of Bonn (DE))
    18/02/2020, 10:00
    Monolithic Sensors (CMOS)
    contributed talk

    With the upgrade of the inner tracking detector of the ATLAS experiment in 2026, the surface covered by hybrid pixel detectors increases from less than 2 m² at present to approximately 13 m². This makes sensor designs that utilize cost-effective, high-throughput CMOS processing lines with large and high-resistive wafers an attractive option. In addition, CMOS process features can be used to...

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  4. Dr Jian Liu (University of Liverpool (GB))
    18/02/2020, 11:00
    HEP Systems
    contributed talk

    Major upgrades of the ALICE experiment are underway and will be completed during the LHC Long Shutdown 2 to enhance the physics capacities of ALICE for LHC Run3 and Run4. One key part of this upgrade is the new Inner Tracking System (ITS2), a CMOS monolithic active pixel sensor based pixel detector. The upgraded Inner Tracking System consists of three innermost layers (50 $\mu m$ thick...

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  5. Magnus Mager (CERN)
    18/02/2020, 11:20
    Monolithic Sensors (CMOS)
    contributed talk

    During LHC LS3, ALICE plans to replace its innermost tracking layers with a new detector that is based on wafer-scale Monolithic Active Pixel Sensors, fabricated in 65 nm on 300 mm wafers. These sensors will be thinned down to 20-40 μm, a thickness such that they become flexible enough to be shaped into half cylinders. This will allow to place them very close to the beam pipe, at a distance of...

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  6. Dominik Dannheim (CERN)
    18/02/2020, 11:40
    Monolithic Sensors (CMOS)
    contributed talk

    Challenging requirements are imposed on the detector for the proposed future Compact Linear Collider CLIC. For the large-area (140 sqm) main tracker, a temporal resolution of a few nanoseconds and a spatial resolution of 7 μm need to be achieved simultaneously with a material budget per layer of 1% of a radiation length. The CLICTD monolithic CMOS sensor has been developed targeting these...

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  7. Jan Hasenbichler (CERN, Vienna University of Technology (AT))
    18/02/2020, 12:00
    Monolithic Sensors (CMOS)
    contributed talk

    Monolithic Active Pixel Sensors (MAPS) are used in many high energy physics experiments, also in ALICE at CERN. To find the most suitable geometry for the current ALICE inner tracking system (ITS2), several slight modifications had to be processed and lots of manual characterisation was done. This added high costs and time to the project. Using modern TCAD device simulation software combined...

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  8. Mr Johannes Martin Wüthrich (ETH Zurich (CH))
    18/02/2020, 12:20
    Monolithic Sensors (CMOS)
    contributed talk

    Wafer-wafer bonding enables the fusion of two semiconductor wafers, without any additional material at the interface. In the context of pixel detectors, the method has the potential to enable limitless combinations of absorber materials with readout chips fabricated with CMOS technologies.

    In this talk we present the status of our studies on the design, optimization and characterization of...

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  9. Philipp Wieduwilt (Georg-August University Göttingen)
    19/02/2020, 12:00
    Monolithic Sensors (CMOS)
    contributed talk

    The Belle II experiment at the super-B-factory SuperKEKB in Tsukuba, Japan started data taking in 2019. Its purpose is the measurement of electroweak phenomena and rare decays with unprecedented high precision. A up to 40-fold increase in instantaneous luminosity compared to the predecessor experiment Belle is targeted and will allow for recording a large dataset at the $\Upsilon(4S)$...

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