Speaker
Description
Abstract:
The talk will address the positive and negative experiences that RI gained during the production of FPC in large scale series (E-XFEL, LCLS-II) and small scale projects. The most critical processes and head-aches will be reflected from “behind the scenes”.
The specifications do often cut the edge of achievable copper plating, TIN deposition and mechanical tolerances in a serial production and sometimes seem to be overshooting. The current development from pulsed to CW machines does raise the question, if the TTF-III coupler as a design baseline is still up to date.
Provocative topics:
Overtight copper plating specifications
TIN deposition control (nanometers!)
Specified mechanical tolerances
Is the TTF-III coupler still up to date?
