We present test results of the hybridized Timespot1 ASIC, developed for 4D-tracking in high luminosity LHC experiments. The ASIC reads a 32x32 pixel matrix bump-bonded on a 3D-type trenched electrode silicon sensor, which already demonstrated intrinsic timing performance and high radiation hardness at test beams, achieving temporal resolutions close to 10 ps. The ASIC is developed in CMOS...
The High Luminosity upgrade of the LHC machine aims at an increase of peak luminosity and to possibly reach an integrated luminosity of $3000-4500\;$fb$^{-1}$. Consequently, the CMS experiment is called for an upgrade to keep up with the new challenges such as unprecedented radiation environment, requiring high resilience, and increased number of events per bunch crossing, requiring higher...
A dedicated 16-channel board was designed for matrix test and inter-pixel proprieties. Each channel is composed of a dual stage amplifier design with an uniform response up to a frequency range of 8 GHz. A single SiGe transistor configuration is used for both stages, with the first acting as a transimpedance amplifier and the second as a voltage amplification stage. The design features a...
A double arm beam telescope was built with Timepix4v2 ASICs to test the performance of the new ASIC’s synchronous readout and track reconstruction capabilities, as well as its temporal performance. The new telescope is composed of eight planes with n-on-p silicon sensors. Four of these planes are instrumented with 300 μm thick sensors tilted with respect to the beam, to provide high quality...
The LHCb experiment has recently been upgraded in the second long
shutdown of LHC. The new Vertex Locator (VELO) is composed of 52
modules with hybrid pixel detector technology. The new detectors
have performed very well throughout the first year of Run 3 of the
LHC, but face new operational challenges with increased radiation
damage foreseen till the end of this run. The cumulative...
The Large Hadron Collider (LHC) next upgrade is the High-Luminosity LHC (HL-LHC) planned to start operation in 2029. One of the most critical and demanding sub-detector systems of the ATLAS HL-LHC upgrade is the Pixel Detector of the Inner Tracker (ITk), which is a key component to achieve excellent track impact parameter resolution.
The basic unit of the ITk Pixel Detector is the pixel...
To cope with the much increased pile-up, data rates and radiation damage from the upgrade of High Luminosity LHC, the current ATLAS Inner Detector will be replaced by an all-silicon Inner Tracker (ITk). The inner most part of ITk will be the pixel detector which covers an area of about 13m^2 and comprises the modules made of silicon planar or 3D sensors bump bonded to readout FE ASICs. Data...
The CMS detector will be upgraded to face a 10-fold increase in integrated luminosity for the High-Luminosity LHC era compared to that of the current LHC Runs 1-3 combined. Its endcap calorimeters will be replaced by the high-granularity calorimeter (HGCAL). With its unprecedented transverse and longitudinal readout/trigger segmentation, with more than 6M readout channels, HGCAL will...
The CMS detector will be upgraded to face a nearly 10-fold increase in integrated luminosity for the High-Luminosity LHC era compared to that of the current LHC Runs 1-3 combined. It will be adapted to the higher levels of radiation and larger amounts of data collected. The endcap calorimeters of the CMS detector will be replaced by the High-Granularity Calorimeter (HGCAL). The HGCAL will...
The current tracking system of the CMS experiment will be fully replaced for the High-Luminosity running phase of the LHC with a planned integrated luminosity of more than 3000 fb$^{-1}$ delivered to the experiments. The innermost layers of the CMS Inner Tracker (IT) will be subject to particle fluences up to about 2 $\times$ 10$^{16}$ cm$^{-2}$ (1 MeV neutron equivalent).
In an extensive...
This study focuses on radiation damage caused by gamma irradiation in standard float zone p-type silicon diodes. We were able to study bulk damage in detail thanks to the separation of bulk and surface currents. The study includes three types of diodes with different resistivities by CNM, HPK and IFX manufacturers. The diodes were irradiated by Cobalt-60 gamma source up to 8.28 MGy in...
The High Luminosity upgrade of the CERN Large Hadron Collider (HL-LHC) calls for an upgrade of the CMS tracker detector to cope with the increased radiation fluence, 2.3E16 neq/cm2 (1MeV equivalent neutrons) for the innermost layer while maintaining the excellent performance of the existing detector. An extensive R&D program aiming at 3D and thin planar pixel sensors, has been put in place by...
CMOS process lines are an attractive option for the fabrication of hybrid pixel sensors for large-scale detectors like ATLAS and CMS. Besides the cost-effectiveness and high throughput of commercial CMOS lines, multiple features like poly-silicon layers, metal-insulator-metal capacitors and several metal layers are available to enhance the sensor design.
After an extensive R&D programme...
LGAD sensors have proven to be an excellent solution for 4D-tracking in HEP experiments thanks to the presence of internal gain that provides good time resolution also at high fluences (up to $\sim 2 \cdot 10^{15}$ neq/cm$^2$). However, approaching $10^{16}$ neq/cm$^2$, the internal gain is completely lost due to the acceptor removal effect, leading to a deterioration of the time...
The High Granularity Timing Detector (HGTD) is designed for the mitigation of pile-up effects in the ATLAS forward region and for bunch per bunch luminosity measurements. HGTD, based on Low Gain Avalanche Detector (LGAD) technology and covering the pseudorapidity region between 2.4 and 4.0, will provide high precision timing information to distinguish between collisions occurring close in...
The Compact Muon Solenoid (CMS) detector at the CERN Large Hadron Collider (LHC) is undergoing an extensive Phase 2 upgrade program to prepare for the challenging conditions of the High-Luminosity LHC (HL-LHC). The addition of the MIP timing detector (MTD) to CMS will be critical to mitigate the impact of high pileup collisions anticipated during the HL-LHC. The MTD will provide timing...
The Low Gain Avalanche Detector (LGAD) is developed with the aim to serve as a timing detector for two leading HEP experiments in CERN, CMS and ATLAS. This means that it is adjusted for work with Minimum Ionizing Particles (MIP). However, its excellent timing resolution and good spatial resolution, have made LGAD an attractive solution in experiments where much higher charge is generated than...
We report an experimental investigation on charge multiplication in a no-gain (inter-pad) region in a multi-pad Ultra Fast Silicon Detector (UFSD). The UFSD sample we measured is not a standard segmented UFSD that is now accepted as CMS LGAD. It is a sample that has been produced in the Ti-LGAD RD50 production batch. Furthermore, this UFSD is not a trench LGAD (Ti-LGAD). This tested UFSD has...
In this work, we present a comprehensive analysis of the spatial and temporal resolutions of RSD sensors belonging to the second FBK RSD production (RSD2). The RSD2 production results from the optimization process performed on the FBK RSD1 sensor production. Specifically, RSD2 sensors have innovative read-out electrode layouts geared toward reaching a uniform response over the whole surface....
In this contribution, the performance of a Resistive Silicon Detector (RSD) measured with 4 GeV electrons at the DESY beam test facility is presented. The device-under-test comes from the second RSD production manufactured at FBK (RSD2). The RSD2 sensors feature a different design with respect to the previous production (RSD1), in order to improve the sharing of signals produced by ionizing...
Capacitive-coupled Low-Gain Avalanche Diode (AC-LGAD) is a semiconductor tracking detector with precise timing resolution and spatial resolution developed by KEK and Tsukuba group collaborating with Hamamatsu Photonics K.K. (HPK). A 100um x 100um pitch pixel type sensor and 80um pitch with 10mm length strip type sensor with 50um active thickness have been successfully developped with fully...
We will present the first beam test results with centimeter-scale AC-LGAD strip sensors, using the Fermilab Test Beam Facility, and a study of the performance of AC-LGAD sensors as a function of their thickness. Sensors of this type are envisioned for applications that require large-area precision 4D tracking coverage with economical channel counts, including timing layers for the Electron Ion...
The present study focuses on the performance evaluation of the first very thin Low Gain Avalanche Detectors (LGADs) prototypes produced by the Fondazione Bruno Kessler (FBK), with a thickness of 25 and 35 $\mu$m, and the introduction of a new concept that consists of two similar LGADs connected to the same board.
Despite its already impressive timing performance, for which this technology...
The High Luminosity upgrade of the CERN Large Hadron Collider (HL-LHC) will require new high-radiation tolerant silicon pixel sensors for the innermost layers of the CMS experiment tracking detectors, which should be capable of withstanding fluences up to 2.3E16 neq/cm2.
A comprehensive overview of the results obtained in beam test experiments with FBK and CNM 3D pixel sensors interconnected...
The High Luminosity program of the Large Hadron Collider (HL-LHC) will improve the performance of the accelerator by increasing the instantaneous luminosity $\mathcal{L}$ up to 7.5$\cdot$ 10$^{34}$ cm$^{-2}$ s$^{-1}$, with an average of 200 proton-proton collisions per beam-crossing. An upgrade of the ATLAS detector is needed to cope with the harsher radiation levels and with a much higher...
The proven radiation hardness of silicon 3D devices up to fluences of $1 \times 10^{17}\;n_{eq}/cm^{2}$ makes them an excellent choice for next generation trackers, providing $<10\;\mu m$ position resolution at a high multiplicity environment. The anticipated pile-up increase at HL-LHC conditions and beyond, requires the addition of < 50 ps per hit timing information to successfully resolve...
We present performance tests on irradiated 3D-trench silicon sensors, developed within the TimeSPOT project. The tests were performed in different experimental conditions and at different fluences, both in the laboratory and in test-beam at SPS, CERN. The tests show excellent time resolution (around 10 ps) and nominal geometric efficiency (around 99%) of such sensors up to the maximum tested...
The MALTA monolithic active pixel sensor produced in TowerJazz 180 nm CMOS technology with pixels of size 36.4 x 36.4 um2 and a 3 µm2 electrode. As part of the MALTA family, the MALTA2 demonstrator features an asynchronous readout with cascoded front-end and demonstrates time resolution below 2 ns with radiation hardness up to 3e15 n/cm2. As such, the...
The ALICE ITS3 (Inner Tracking System 3) upgrade project together with the CERN EP R&D on monolithic sensors are exploring the Tower Partner Semiconductor Co. (TPSCo) 65 nm ISC process.
The ITS3 project aims to build the first fully cylindrical tracker by using wafer scale, ultra thin (20 - 40 μm) bent MAPS.
Four different pixel test structures, Circuit Exploratoire 65 (CE65), Digital Pixel...
In the coming years the Large Hadron Collider (LHC) at CERN is being upgraded to work at higher luminosities, leading to the High-Luminosity LHC. The HL-LHC will reach luminosities up to 5 × 10$^{34}$ cm$^{−2}$ s$^{−1}$ collecting at least 3000 fb$^{−1}$ of data in its lifetime. To handle the increased luminosity and data rate, the experiments at the LHC will be upgraded as well. One of the...
The High Voltage CMOS (HV-CMOS) technology is a promising candidate for future particle physics experiments. To meet the needs of future experiments, especially in terms of single point resolution ($50 \times 50 \mathrm{\mu m^2}$), time resolution (0.2 ns) and radiation tolerance ($10^{16} \mathrm{n_{eq}/cm^2}$), the HV-CMOS pixel sensor performance needs to be further improved. The Liverpool...
The astroparticle physics experiments operating in space for the measurement of charged cosmic rays include a tracker and a calorimeter to identify the incoming primary charged cosmic rays. These experiments face challenges in separating primary particles from the back-scattered particles entering the tracker from the calorimeter. The timing measurement of each hit can be used to distinguish...
Small-pitch 3D pixel sensors have been developed to equip the innermost layers of the ATLAS and CMS tracker upgrades at HL-LHC. They feature 50$\times$50 and 25$\times$100 $\mu m^2$ geometries, and are fabricated on p-type Si-Si Direct Wafer Bonded substrates of 150 $\mu m$ active thickness with a single-sided process. Due to the short inter-electrode distance, charge trapping effects are...
One of the requirements for the next generation of tracking sensors is a good time resolution, down to tens of picosecond.
For hybrid pixel sensors, one of the limiting factor for the temporal resolution comes from the readout electronics.
Simulations of typical charge sensitive amplifier electronic front end has been performed and the results shows that the timing jitter
is dominated by...
Monolithic sensors are regarded nowadays as valid alternatives to hybrid detectors in the design of next generation high-performance silicon vertex, tracking and timing detectors for high-energy physics (HEP) experiments and other fields of research like medical imaging and space applications.
In this context, Fully Depleted Monolithic Active Pixel Sensors (FD-MAPS) are a state-of-the-art...
Monolithic CMOS pixel sensors (or MAPS) offer a particularly advantageous balance between pixel granularity, hit rate and power dissipation, making them attractive devices for vertexing and tracking. Existing reticule-size sensors [1, 2, 3] display power ranging roughly from 35 to 100 mW/cm2 for corresponding hit rates in the range 10 to 100 MHz/cm2 and timestamping capabilities from 5 µs down...
The semiconductor industry is currently adopting SiC as a replacement for silicon in power devices. Compared to Si, SiC offers several advantages which make it an attractive detector material. Among them is the higher displacement energy as compared to silicon, which makes SiC potentially more radiation hard. The very low leakage currents do not increase even for highly irradiated samples....
X-ray color imaging is a promising method that provides extra information due to photon energy binning. Due to the high demand for high spatial resolution, the detectors tend to decrease the pixel pitch size. The decreasing pixel pitch size directly affects the spectral resolution due to the charge-sharing effect and fluorescent photons that travel elsewhere in the sensor material. Therefore,...
A new application for monolithic pixel detectors is NASA’s AMEGO-X project, which is a low-orbit gamma ray observatory for multimessenger astrophysics, proposed as a 3 to 5 year mission. For the 40-layer gamma-ray telescope, which will consist of over 64000 sensors with a total area of more than 25 m², a new low power and high dynamic range monolithic active pixel sensor named AstroPix is...
Silicon Photomultipliers (SiPMs) are well known as excellent light detectors in the ultraviolet to visible energy range with sub-nanosecond time resolution. Due to their unique characteristics, these detectors are widely used in high-energy physics and medical imaging systems. In conventional SiPMs, an array of Single Photon Avalanche Diodes (SPADs) is connected in parallel. In these devices...
MoTiC (Monolithic Timing Chip) is a prototype DMAPS Chip that builds on sensor technology developed in the ARCADIA project.
The 50 by 50$\mu$m$^2$ pixels contain a small charge collecting electrode with a very low capacitance surrounded by radiation-hard in-pixel electronics.
The chip contains a matrix of 5120 pixels on an area of 3.2 by 4 mm$^2$.
Each pixel features a trimmable and...
The MONOLITH ERC Advanced project aims at producing a monolithic silicon pixel ASIC with 50µm pixel pitch and picosecond-level time stamping. The two main ingredients are low-noise, fast SiGe BiCMOS electronics and a novel sensor concept, the Picosecond Avalanche Detector (PicoAD). The PicoAD uses a patented multi-PN junction to engineer the electric field and produce a continuous gain layer...
The 100µPET project, led by the University of Geneva, the University of Luzern, and the École Polytechnique Fédérale de Lausanne, aims at the development of a small-animal positron-emission tomography (PET) scanner with ultra-high-resolution molecular imaging capabilities. This is achieved through the use of a compact, modular stack of multiple thin layers of monolithic pixel detectors and...
Introduction:
A normal tissue sparing effect (FLASH effect) has been observed in Ultra-High Dose-Rate electron and proton irradiation (UHDR). In this extreme regime, conventional transmission chambers show non-linear effects due to very high flux of particles. Therefore, the real time beam monitoring in UHDR requires the adaptation of detector technologies and the investigation of new...
Semiconductor detectors are a popular choice in many areas of physics because of their flexibility. One possible technology of semiconductor detectors is silicon strip detectors (SSDs): by means of segmenting readout electrodes in the form of thin, long strips, it is possible to measure several properties of charged particles, keeping under control the number of channels.
The ability to...
Introduction:
The single particle tracking is a demanding task in clinical particle beams due to the high instantaneous fluence rate, up to $10^{10}$ protons/cm$^{2}$·s and $10^{8}$ carbon ions/cm$^{2}$·s. The aim of a fast and accurate (< 1% uncertainty) single particle counter is to overcome the slow charge collection times (hundreds of microseconds) and low sensitivity (thousands of...
The FASER experiment at the LHC will be instrumented with a high precision W-Si preshower to identify and reconstruct electromagnetic showers produced by two O(TeV) photons at distances down to 200µm. The new detector features a monolithic silicon ASIC with hexagonal pixels of 100 µm pitch, extended dynamic range for the charge measurement and capability to store the charge information for...
We report on the study of the radiation tolerance of silicon carbide (SiC) pn planar diodes manufactured at IMB-CNM. Dedicated TPA-TCT and TRIBIC measurement campaigns, carried out at the UPV-EHU and CNA femto laser and ion microbeam facilities respectively, were used to characterise the response of the diodes. The studied devices were irradiated with neutrons up to a fluence of...
Hybrid pixel detectors require a reliable and cost-effective interconnect technology adapted to the pitch and die sizes of the respective applications. During the ASIC and sensor R&D phase, and for some small-scale applications, such interconnect technologies need to be available for the assembly of single-dies. Within the CERN EP R&D program and the AIDAinnova collaboration, innovative pixel...
The Two Photon Absorption – Transient Current Technique (TPA-TCT) exploits the quadratic absorption mechanism of light, to only excite charge carriers in a small volume around the focal point. Compared to conventional TCT methods that use light in the linear absorption regime, TPA-TCT enables true 3-dimensional resolution, while providing all the benefits of conventional TCT.
The TPA-TCT...
