Speakers
Description
Microchannel cooling technology offers an excellent thermal figure of merit solution to remove the heat from the front-end electronics and/or sensors. This presentation will cover different techniques and substrate materials to deliver the next generation of cooling plates based on power dissipation up to 2W/cm2 (LHCb VELO Upgrade 2 as benchmark), material budget equal or below 0.5%X0, better electronics integration and/or cost. Along those lines four different topics will be presented: Silicon microchannels via buried channels exploring better electronics integration via re-distribution metal layer; Silicon microchannels production via thermo-compression and hyperbaric process aiming for cost-reduction, integration and scalability; 3D metal printing for design flexibility and cost-reduction; ceramics manufacturing processes such as LTCC and HTCC to include electronic features in the cooling substrate by inclusion of lines in between layers or components on its surface.
