Speaker
Haripriya Bangaru
Description
Within the CERN EP R&D programme and the AIDAinnova collaboration, innovative and scalable hybridization and module-integration concepts are pursued for pixel-detector applications in future colliders. Most interconnect processes require specific surface properties and topologies of the bonding pads. An in-house Electroless Nickel Gold (ENIG) plating process is therefore under development, which is performed on single-die level and can be adapted to a large range of pad geometries and bonding techniques. This contribution introduces the ENIG process and its optimisation and shows example plating results for dedicated test structures and functional ASICs and sensors.
| Type of presentation (in-person/online) | in-person presentation |
|---|---|
| Type of presentation (scientific results or project proposal) | Presentation on scientific results |
Authors
Dr
Ahmet Lale
Alexander Volker
(KIT - Karlsruhe Institute of Technology (DE))
Dominik Dannheim
(CERN)
Giovanni Calderini
(LPNHE-Paris, Centre National de la Recherche Scientifique (FR))
Haripriya Bangaru
Janis Viktor Schmidt
(KIT - Karlsruhe Institute of Technology (DE))
Justus Braach
(CERN, Hamburg University (DE))
Mateus Vicente Barreto Pinto
(Universite de Geneve (CH))
Matteo Centis Vignali
(FBK)
Peter Svihra
(CERN)
Rui De Oliveira
(CERN)
Xiao Yang
(CERN)
