Conveners
WG/WP1 - CMOS technologies: WG1 talks
- Jerome Baudot (IPHC - Strasbourg)
- Eva Vilella Figueras (University of Liverpool (GB))
- Heinz Pernegger (CERN)
WG/WP1 - CMOS technologies: WP1 review of project proposals
- Heinz Pernegger (CERN)
- Eva Vilella Figueras (University of Liverpool (GB))
- Jerome Baudot (IPHC - Strasbourg)
WG/WP1 - CMOS technologies
- Eva Vilella Figueras (University of Liverpool (GB))
Description
The session on CMOS sensors
The Belle II experiment currently records data at the SuperKEKB e+e- collider, which holds the world luminosity record of $4.7x10^{34} cm^{-2}s^{-1}$ and plans to reach $6x10^{35} cm^{-2}s^{-1}$ at the end of the decade. In such luminosity range for e+e- collisions, the inner detection layers should both cope with a hit rate dominated by beam-induced parasitic particles and provide minute...
Coarsely segmented Si diode detectors are widely used in space applications for measuring the mixed radiation fields. Starting in 2012, when 5 Timepix chips were installed at the International Space Station hybrid pixel detectors have entered space radiation dosimetry and monitoring. The problems to be solved for measuring GCR and SEP events are the dynamic range of the charge signal which...
A MAPS based inner tracker is proposed for the Super Tau-Charm Facility, a next-generation high-luminosity electron-positron collider operating in the tau-charm energy regime. In order to satisfy the challenge of high luminosity, high event rate, and the high tracking performance of benchmark physics programs, the inner tracker has to be of low power consumption, low material budget and...
PSI is developing DMAPS prototype chips with time of arrival measurements for potential use in small scale physics experiments at PSI and also for detectors used outside the field of particle physics. After the production of a first basic prototype in the TSI 180nm process node we have recently switched to LF 150 and just submitted a design in a MPW run. We will present the design of this...
Since 2003, IPHC Strasbourg, Goethe University Frankfurt, and GSI have been performing R&D to develop sensors for the Micro Vertex Detector of CBM at FAIR. Complemented by R&D targeting the ALICE-ITS3, this research activity now focuses on developing the MIMOSIS sensor. In response to the particular needs of fixed-target heavy ion physics experiments, MIMOSIS features a spatial/time resolution...
High voltage CMOS pixel sensors are proposed to be used in future particle physics experiment. The ATLASPIX3 chip consists of 49000 pixels of dimension 50ฮผm x 150 ฮผm, realized in in TSI 180nm HVCMOS technology. It was the first full reticle size monolithic HVCMOS sensor suitable for construction of multi-chip modules and supporting serial powering through shunt-LDO regulators. The readout...
The RD50-MPW4, the latest iteration in the HV-CMOS pixel sensor series developed collaboratively by the CERN-RD50-CMOS working group, marks a significant advancement in the RD50-MPW series. Rooted in generic research and development, the RD50-MPW program aims to address challenges posed by future physics experiments, such as HL-LHC and FCC, focusing on radiation tolerance, granularity, and...
The pilot project aims to modularise, adapt and integrate the original MPW4 firmware developed at HEPHY into Caribou's new Boreal architecture. This initiative marks the introduction of the first chip within Caribou's new modular firmware. Leveraging the original MPW4 firmware developed at HEPHY, the project focuses on modularisation, adaptation and integration into the user core of the Boreal...
The increasing availability of high-resistivity substrates and high-voltage capabilities in commercial CMOS processes facilitate the application of depleted monolithic active pixel sensors (DMAPS) in modern particle physics experiments. TJ-Monopix2 and LF-Monopix2 chips are the most recent large-scale prototype DMAPS in their respective development line originally designed for compliance with...
The MALTA family of Monolithic Active Pixel Sensors produced in Tower 180 nm CMOS imaging technology on high-resistivity epitaxial silicon and on Czochralski substrates with a pixel size of 36.4 um2, and a 3 um2 electrode size, feature an asynchronous read-out architecture. Several process modifications, and front-end improvements have been implented on several prototypes that have resulted in...
The High-Voltage CMOS technology is intrinsically radiation-hard and fast at charge collection, making it a promising technological option for tracking detectors at future experiments requiring large-area coverage, high spatial resolution and radiation tolerance. Such examples are LHCb Upstream Trackers in Upgrade II, or inner tracking detector at Circular Electron-Positron Collider (CEPC)....
The CASSIA Project (CMOS Active SenSor with Internal Amplification) aims to develop monolithic MAPS with internal signal gain and low noise in a widely used CMOS imaging process towards a broad range of applications. Monolithic CMOS sensors with internal gain can provide several advantages for future monolithic CMOS detector systems: Due to internal amplification these sensors produce higher...
CMOS sensor technology leverages the production of fully monolithic pixel detectors with smaller pixel size and without costly interconnections between sensors and readout electronics. This results in cost reduction and lower material budget in the detector volume.
An additional opportunity for further improvement is the module assembly method. By integrating power- and data lines directly...
The IPHC Strasbourg has been developing CMOS pixel sensors for over two decades. The laboratory leverages the unique expertise of its C4PI microelectronic platform, encompassing everything from design to testing, in close collaboration with scientific groups. IPHC participates in numerous vertex and tracking detector projects, including CBM-MVD, ALICE ITS-3, the Belle-2 upgrade, and future e+e...
Monolithic active pixel sensors (MAPS) are attractive candidates for the next generation of vertex and tracking detectors for future lepton colliders. Especially an only recently accessible 65 nm CMOS imaging technology, that allows for higher logic density at lower power consumption compared to currently used imaging processes, is of high interest. To investigate this technology, explore the...
This project concerns the simulation, development and evaluation of monolithic fine-pitch pixel sensors implemented in the TPSCo65 process, targeting the vertex-detector requirements of future Lepton Colliders as outlined in the ECFA detector roadmap. Key final development goals include 3 ยตm single-point resolution, down to 5 ns time resolution as required for the high-energy Linear-Collider...
This project addresses the development in the TPSCo 65 nm CMOS process of prototype monolithic active pixel sensors matching the needs of the next generation of trackers in high energy physics.
The guiding principle is to establish a versatile pixel matrix design suited for various trackers with possibly diverse hit-rate (1 to 100 MHz/cm2), time resolution (1 to 100 ns), radiation...
This abstract summarise a preliminary proposal focuses on low-power, high granularity tracking detectors R&D using MAPS technology thatโs suitable for large-area application in modest radiation environments for future particle physics experiments, in particular the future Higgs factory experiments where silicon layers of 50-100 m2 are foreseen..
This proposal follows two complementary...
Large size electrode monolithic sensor designs have been explored successfully in the past, mainly for tracking applications. Notable examples of this concept are LF-CPIX, followed by the large size (1 cm2) LF-MONOPIX1, LF-MONOPIX2 and TJ-MONOPIX demonstrators, intended for ATLAS ITK outer layers. LF-CPIX, LF-MONOPIX1 and LF-MONOPIX2 were designed in LF-15A technology, and TJ-MONOPIX is in...
The CASSIA Project (CMOS Active SenSor with Internal Amplification) aims to develop monolithic MAPS with internal signal gain and low noise in a widely used CMOS imaging process towards a broad range of applications. The current developments are based on the Tower Semiconductor CIS 180nm technology in view of later portability towards other processes including smaller node size process (e.g....
The DRD7 collaboration intends to develop future electronic systems and technologies for particle physics detectors, and provide a platform to enhance the cooperative effort within the community necessary to address the increasing complexity of these systems and technologies. Within this effort the 7.6a work package concentrates on providing common access to advanced imaging technologies...
This is not a project proposal, but was meant as a WP1 discussion contribution: Experience has shown that the availability of proprietary processes that we invested a lot of money and manpower into is not guaranteed. One possible mitigation might be to evaluate "OpenSource" processes (ideally including OpenPDKs, OpenSource documentation of the process details like doping profiles and...
State-of-the-art silicon tracking detectors, used in the current generation of physics experiments such as the Large Hadron Collider (LHC) at CERN, are not able to meet in a single sensing device the challenging specifications anticipated by future experiments. These specifications include high radiation tolerance and low-mass, along with fast timing, high spatial resolution and low-power...
An asynchronous read-out architecture was developed for the MALTA family of Pixel detectors in Tower 180 nm as an alternative to well established column-drain architecture by means of a self-generating reference pulse in groups of 8x2 pixels without the distribution of a clock over the matrix, a power consumption smaller than 80 uW/cm2 and a hit rate capability larger than 1 GSps. The aim of...
Within this project next generation strip sensors for large area applications will be developed. In recent years the consortium of the universities of Bonn, Dortmund, Freiburg and DESY developed stitched passive CMOS strip sensors fabricated by LFoundry in a 150 nm technology, with an additional backside processing from IZM Berlin. The sensors have a thickness of 150 ฮผm, a resistivity of 3-5...
In view of the Long Shutdown 3 the ALICE experiment is foreseeing an upgrade of the inner barrel of its Inner Tracking System (ITS3), based on Monolithic Active Pixel Sensors produced in a commercial 65 nm CMOS technology. This technology represents the baseline for the development of tracking systems for future experiments at colliders (NA60+, EPIC@EIC, ALICE 3, FCCโฆ).
ALICE 3 experiment has...
