Conveners
WG7/WP4 - Interconnect technologies: WG7 talks
- Fabian Huegging (University of Bonn (DE))
- Dominik Dannheim (CERN)
- Giovanni Calderini (LPNHE-Paris, Centre National de la Recherche Scientifique (FR))
Within the CERN EP R&D programme and the AIDAinnova collaboration, innovative and scalable hybridization and module-integration concepts are pursued for pixel-detector applications in future colliders. Most interconnect processes require specific surface properties and topologies of the bonding pads. An in-house Electroless Nickel Gold (ENIG) plating process is therefore under development,...
A reliable and cost-effective interconnect technology is required for the development of hybrid pixel detectors. The interconnect technology needs to be adapted for the pitch and die sizes of the respective applications. This contribution presents recent results of an in-house single-die interconnection process based on Anisotropic Conductive Adhesives (ACA), which is under development within...
A significant effort is underway to develop large area and lightweight modules using monolithic sensor demonstrators. These studies are performed within CERN's R&D programme on technologies for future experiments (EP R&D). A novel flex PCB has been designed to reduce the material budget as much as possible while ensuring dense packaging maximising the active area in the detector. Scalable...
The 100µPET project is developing a pre-clinical medical scanner for positron-emission tomography (PET) with ultra-high-resolution molecular imaging capabilities. The scanner comprises multiple layers of monolithic active pixel sensors (MAPS) connected to flexible printed circuits (FPC). With pixels of 150 µm pitch and a thickness of 270 µm + 300 µm (MAPS + FPC), the scanner achieves an...
We will present and discuss the lessons learned during the R&D and production phase of the all-silicon detector modules for Belle II PXD. The focus will be on technology and quality control in the production phase. The same technology is also being utilised for direct electron detectors and is now being extended to incorporate active cooling with integrated micro-channels.
Finally we will...
Wafer to wafer bonding offers an economic approach to interconnect all readout electronic chips with the solid-state sensor chips on the wafer by only one bonding step. This is a promising technology for the fabrication of 3D integrated ultra-thin hybrid modules for particle detection and timing layers in future particle detectors. The technology described in this paper combines the...
