6–10 Jul 2025
Bratislava, Slovakia
Europe/Zurich timezone

Study of the charge carrier properties of a pixelated 4H-SiC with Timepix3

Not scheduled
20m
Bratislava, Slovakia

Bratislava, Slovakia

poster

Speaker

Dr Petr Smolyanskiy (Czech Technical University in Prague (CZ))

Description

Recent advantages in the detector production have facilitated the manufacture of pixelated 4H-SiC detectors, which can be an alternative to silicon ones especially in the harsh radiation environment, or in the environment with high temperatures, where such sensors profit from their higher band gap. Moreover, thanks to an elastic scattering cross-section of carbon for fast neutrons the SiC sensors have higher neutrons detection efficiency than Si sensors.

In the present contribution, we characterize pixelated 4H-SiC sensors of ~80 µm sensitive thickness flip-chip bonded to the Timepix3 ASIC. Comprehensive testing was performed including measurement of IV curves, depletion voltage scans, determination of the achievable energy resolution for gammas and MIPs, as well as a study of the response to monoenergetic fast neutrons, and mixed relativistic ions. By performing measurements at grazing angle, the latter measurement allows to study the dependence of the holes drift velocity on the electric field when irradiating at grazing angle utilizing the 1.5 ns time-stamp measurement precision of Timepix3 [1]. The holes mobility was measured to be μh = (35.2±3.5) cm2/V/s, consistent with literature.

References
[1] P. Smolyanskiy et al 2021 JINST 16 C12023

Acknowledgements
B.B. and P.S. acknowledge funding from the Czech Science Foundation (GACR) under Grant No. GM23-04869M.

Workshop topics Sensor materials, device processing & technologies

Author

Dr Petr Smolyanskiy (Czech Technical University in Prague (CZ))

Co-authors

Andrea Sagatova (Slovak University of Technology in Bratislava) Benedikt Ludwig Bergmann (Czech Technical University in Prague (CZ)) Bohumir Zatko (Institute of Electrical Engineering, Slovak Academy of Sciences) Stanislav Pospisil (Czech Technical University in Prague (CZ))

Presentation materials