Workshop on Quality Issues in Current and Future Silicon Detectors

Session

Modules - Interconnects: Wire and Bump Bonding

3

3 Nov 2011, 11:30

222/R-001 (CERN)

Conveners

Modules - Interconnects: Wire and Bump Bonding

• Michael Campbell (CERN)

Modules - Interconnects: Wire and Bump Bonding

• Michael Campbell (CERN)

30. Bump Bonding Issues, Industry Perspective

Sami Vähänen (VTT technical research centre of Finland)

03/11/2011, 11:30

31. Wire Bonding Issues, seen by CERN Bond Lab

Alan Honma (CERN)

03/11/2011, 12:00

32. ATLAS Pixel Interconnects Issues

Daniel Dobos (CERN)

03/11/2011, 14:00

33. CMS Pixel Interconnects Issues

Tilman Rohe (Paul Scherrer Institut (CH))

03/11/2011, 14:25