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Workshop on Quality Issues in Current and Future Silicon Detectors

3–4 Nov 2011
CERN
Europe/Zurich timezone

Session

Modules - Interconnects: Wire and Bump Bonding

3
3 Nov 2011, 11:30
222/R-001 (CERN)

222/R-001

CERN

Building 222-R-001
200
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Conveners

Modules - Interconnects: Wire and Bump Bonding

  • Michael Campbell (CERN)

Modules - Interconnects: Wire and Bump Bonding

  • Michael Campbell (CERN)

Presentation materials

There are no materials yet.

  1. 30. Bump Bonding Issues, Industry Perspective
    Sami Vähänen (VTT technical research centre of Finland)
    03/11/2011, 11:30
  2. 31. Wire Bonding Issues, seen by CERN Bond Lab
    Alan Honma (CERN)
    03/11/2011, 12:00
  3. 32. ATLAS Pixel Interconnects Issues
    Daniel Dobos (CERN)
    03/11/2011, 14:00
  4. 33. CMS Pixel Interconnects Issues
    Tilman Rohe (Paul Scherrer Institut (CH))
    03/11/2011, 14:25
Building timetable...