Speaker
Description
We are organising a DRD3 community shared submission in the 150 nm High Voltage CMOS process (LF15A) from LFoundry. This joint submission will include several chips designed by the DRD3 community to further advance the R&D of High Voltage CMOS sensors for future detector applications in physics experiments. By sharing the wafer among several chips with compatible requirements, this collaborative submission offers a cost-effective route for sensor R&D. The chip design work is currently ongoing and the tape-out is tentatively planned for spring 2026.
The presentation will outline the submission details (such as reticle area, substrate resistivity and available metal layers), show the preliminary reticle floorplan, and provide an overview of the individual chips and their current design status.
| Type of presentation (in-person/online) | online presentation (zoom) |
|---|---|
| Type of presentation (I. scientific results or II. project proposal) | II. Presentation on project proposal |
