Speaker
Dr
Ahmet Lale
Description
The development of hybrid pixel detectors requires reliable, flexible and cost-effective interconnect technologies that are suitable for single-die processing in R&D projects and for low-volume productions.
This presentation reports on the current status and recent progress of in-house hybridization techniques developed within the CERN EP R&D programme and the DRD3 collaboration. These include bonding methods based on Anisotropic Conductive Adhesives (ACA) and gold-stud bonding with epoxy underfill. The ACA approach replaces conventional solder bumps with conductive micro-particles embedded in an epoxy matrix—applied either as a film or a paste—and enables electro-mechanical connections through thermo-compression using a flip-chip bonder.
| Type of presentation (in-person/online) | in-person presentation |
|---|---|
| Type of presentation (I. scientific results or II. project proposal) | I. Presentation on scientific results |
Authors
Abhishek Sharma
(CERN)
Dr
Ahmet Lale
Dominik Dannheim
(CERN)
Giovanni Calderini
(LPNHE-Paris, Centre National de la Recherche Scientifique (FR))
Mateus Vicente Barreto Pinto
(Universite de Geneve (CH))
Moritz Lauser
(KIT - Karlsruhe Institute of Technology (DE))
