Speaker
Description
Thanks to their radiation hardness, demonstrated up to a fluence of $3×10^{16}$ 1 MeV $n_{eq}$/$cm^2$, and their fast response times, 3D sensors are among the most promising technologies for meeting the stringent requirements of current and next-generation vertex detectors at the Large Hadron Collider (LHC). FBK has been actively engaged in 3D detector development for many years, introducing numerous process innovations and supplying sensors for CERN experiments, including CMS (CROC) and ATLAS (ITKPix), with these productions now nearing completion. We are currently fabricating a batch of Si-3D devices based on square pixels with 1E and 2E electrode configurations, with a minimum pitch of 45 µm, aiming to achieve a time resolution of approximately 30 ps even at extreme fluences up to $10^{17}$ $n_{eq}$/$cm^2$. Furthermore, we are carrying out technological tests aimed at achieving an aspect ratio of approximately 30:1, to enable the fabrication of fully through-going columns on thick substrates.