Speaker
Description
The Phase-2 upgrade of the CMS pixel tracker for High-Luminosity LHC is entering a crucial stage, with several Inner Tracker components already in production or transitioning from prototyping to full-scale manufacturing. System tests are ongoing to validate the performance of the upgraded detector, and integration is scheduled to begin in 2026 for all Inner Tracker subsystems.
The procurement and qualification of nearly 47,000 CROCv2 pixel readout ASICs, developed within the RD53 Collaboration, has been completed in 2024-2025. Pixel sensor production is also well advanced, with more than 90% of planar sensors and over 50% of 3D sensors delivered thus far. These readout chip and sensor batches have enabled the assembly of pre-production detector modules, including flip-chip hybrids from all vendors and covering all sensor technologies. Inner Tracker services, such as low-mass electrical links and flex PCBs for power and high-voltage bias distribution, are likewise progressing, with most components in production or nearing completion.
System test activities are intensifying across all pixel tracker subsystems, making use of an increasing fraction of final components. Current test setups support detailed thermal and electrical characterisation, validation of serial powering operation, and studies of optical readout performance.
This contribution will present an overview of the current status of the CMS pixel tracker Phase-2 upgrade, with a focus on the latest results from component production, module pre-production, and system-level testing.