5th DRD3 week on Solid State Detectors R&D

Session

WG7 (WP4)

30 Jun 2026, 16:00

Institute of Space Science & National Institute of Materials Physics

75. Introduction

Dominik Dannheim (CERN), Fabian Huegging (University of Bonn (DE)), Giovanni Calderini (LPNHE-Paris, Centre National de la Recherche Scientifique (FR))

30/06/2026, 16:00

36. In-house Flip-Chip Hybridisation Updates

Dr Ahmet Lale

30/06/2026, 16:05

WG7 - Interconnect

Hybrid pixel detector developments strongly rely on fast, reliable and cost-effective interconnection technologies, particularly during prototyping phases. Conventional wafer-level hybridisation techniques provide excellent performance but require complex industrial infrastructures, long turnaround times and high production costs. These constraints limit rapid design iterations and reduce...

76. First results from irradiation tests of ACA-bonded chain devices (t.b.c.)

30/06/2026, 16:25

54. First preliminary results on bonding activities at INFN Cagliari

Angelo Loi (Universita e INFN, Cagliari (IT))

30/06/2026, 16:40

WG7 - Interconnect

The development of advanced IC packaging, such as hybridization in hybrid pixel detectors, for high-energy physics (HEP) typically requires complex bonding techniques that are highly demanding in terms of both time and costs. This challenge is particularly pronounced in single-die R&D, where bonding only a few dies is disproportionately high in terms of costs and time.

As a low-cost and...

71. In-house indium bumping and bonding for fine-pitch hybrid pixel detector R&D

Mateus Vicente (Geneva Connection Technologies)

30/06/2026, 17:00

WG7 - Interconnect

Hybrid pixel detector R&D requires flexible interconnection technologies that can support small-volume prototyping, rapid design iterations and increasingly fine pixel pitches. Indium bump bonding is a well-established approach in HEP detector production and remains attractive as pitches decrease, offering a complementary route to adhesive-based bonding techniques such as ACF.

This...

67. Nanowire-Based Thermal Interconnects for Enhanced Thermal Management in High-Density Silicon Pixel Modules

Julian Weick (CERN)

30/06/2026, 17:20

WG7 - Interconnect

The increasing integration density of silicon pixel sensors, together with emerging applications such as module-level power conversion and enhanced on-detector signal processing, significantly raises the demand for advanced thermal management solutions. Efficient heat removal at the module level is becoming a critical requirement for ensuring stable and reliable operation. In this work, we...

52. All-Silicon Modules - RDL layers for thin CMOS chips

Andreas Ulm

30/06/2026, 17:40

WG7 - Interconnect

Silicon Pixel Detectors are an essential part of most modern tracking systems for high energy physics as they can fulfill requirements of high spacial and time resolution, feasible power consumption and relatively low material budget. To cover large areas in the detector volume individual chips are glued together to create modules. These modules are easier to assemble to full tracking systems,...