Speaker
Description
Summary
Wafers have been probed at Bonn U., where detailed analog measurements have been made. Distributions of analog parameters will be shown and explained. also digital tests have been made including scan chains. The yield is high- around 65%, allowing up to 0.2% bad pixels, but there is significant variation from wafer to wafer. More detailed digital tests have been performed at a vendor using commercial equipment and these results will be compared. Chip on boards have been measured vs. temperature and radiation dose. Two alternate references were included in the design to control voltage regulators, but it turns out that neither one by itself has the ideal behaviour (stable with temperature and radiation and start-up safe always). However, the desired behaviour has been obtained by combining the references externally. A via mask change has been introduced for additional wafers being produced to fix a an ESD protection mistake important one pad. However, it has been decided that this is not a mandatory fix for IBL use, as the same level of protection can be provided by a using a specific wire bonding sequence.
