TWEPP 2012 Topical Workshop on Electronics for Particle Physics

Session

A1b

Asics

18 Sept 2012, 11:10

Oxford University, UK

Conveners

A1b: ASICS

• Marcus Julian French (STFC - Science & Technology Facilities Council (GB))

75. A monolithic pixel sensor (TRAPPISTe-2) for particle physics instrumentation in OKI 0.2μm SOI technology

Lawrence Soung Yee (Universite catholique de Louvain)

18/09/2012, 11:10

Oral

A monolithic Active Pixel sensor for charged particle tracking has been developed. This sensor is within the frame of a R&D project called TRAPPISTe (Tracking Particles for Physics Instrumentation in SOI Technology), with the aim of studying the feasibility of developing a Monolithic Active Pixel Sensor (MAPS)with SOI technology. TRAPPISTe-2 is the second prototype in this series and was...

84. Vertically Integrated Circuits for Detectors at Fermilab

Mr Ray Yarema (FNAL)

18/09/2012, 11:35

Oral

The paper reviews the advancements in the three-dimensional integration of circuits for readout of solid-state detectors. It focuses on the details of the first 3D MPW run submitted in the HEP community. New high density circuit bonding techniques, wafer thinning, and submicrometer size TSVs IC provide new opportunities for a detector designer. These opportunities will be presented by looking...

156. Prototype Test Results of the Data Handling Processor for the DEPFET Pixel Vertex Detector.

Mikhail Lemarenko (Universitaet Bonn (DE))

18/09/2012, 12:00

Oral

In the new Belle II detector, which is currently under construction at the Super-KEKB e+/e- collider, two additional pixel layers using the DEPFET technology will be introduced- to improve the vertex reconstruction in the high luminosity environment. The Data Handling Processor chip, which is directly bump bonded to the silicon of the DEPFET modules, is designed to steer the readout process,...