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TWEPP 2012 Topical Workshop on Electronics for Particle Physics

17–21 Sept 2012
Oxford University, UK
Europe/Zurich timezone

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Session

A1a

Asics
18 Sept 2012, 09:50
Oxford University, UK

Oxford University, UK

<font face="Verdana" size="2"><b>Clarendon Laboratory</b> Parks Road OX1 3PU, Oxford, United Kingdom

Conveners

A1a: ASICS

  • Marcus Julian French (STFC - Science & Technology Facilities Council (GB))

Presentation materials

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  1. 30. Characterization of FE-I4B pixel readout chip production run for ATLAS Insertable B-Layer upgrade.
    Malte Backhaus (Universitaet Bonn (DE))
    18/09/2012, 09:50
    Oral
    A production run of FE-I4 pixel readout chips (denominated FE-I4B) was submitted September 2011 and first wafers were received in December. These chips are being used to build the Insertable B-Layer upgrade for ATLAS, to be installed during the 2013-14 shutdown. Results will be presented for detailed probing characterization of these wafers, as well as measurements of chips on boards before...
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  2. 94. Results of 65nm pixel readout chip demonstrator array
    Mohsine Menouni (Centre National de la Recherche Scientifique (FR))
    18/09/2012, 10:15
    Oral
    we have explored the use of the 65 nm CMOS technology node for pixel readout. A demonstrator 500-pixel matrix containing analog front ends only (no complex functionality), was designed and fabricated in Summer 2011, and irradiated with protons in Dec. 2011 and May 2012. We present the design and measurement results for this prototype.
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