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    Convergent Intelligence: AI Hardware Co-Design and the Future of Intelligence

    29–30 Sept 2026
    US/Central timezone

    Contribution List

    32 out of 32 displayed
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    1. 1. Welcome & Opening Remarks
      Mark Neubauer (Univ. Illinois at Urbana Champaign (US))
      29/09/2026, 09:00
    2. 2. Co-Designing the Next Generation of AI Computing Infrastructure
      Nhan Tran (Fermi National Accelerator Lab. (US))
      29/09/2026, 09:15
    3. 3. HLS4ML Toolkit and NSF Phase-II POSE Project: Open Infrastructure for Accessible AI Hardware
      Seda Ogrenci (Northwestern University)
      29/09/2026, 09:50
    4. 25. Open Source Tools for FPGAs
      Edmund Humenberger (Symbiotic EDA)
      29/09/2026, 10:20
    5. 29. Responsible AI in the Generative Era
      Anne Lee (Bell Labs Fellow)
      29/09/2026, 11:00
    6. 4. Real-Time AI for Science: The Accelerated AI Institute for Data-Driven Discovery
      Shih-Chieh Hsu (University of Washington Seattle (US))
      29/09/2026, 11:30
    7. 27. Real-Time AI for Fusion Energy Research
      Tom Gibbs (NVIDIA)
      29/09/2026, 12:00
    8. 6. Robot Intelligence through the Perception Laboratory at TTI-Chicagod
      Matthew Walter (Toyota Technological Institute at Chicago)
      29/09/2026, 13:45
    9. 7. Safety Evaluation and Improvement for Embodied AI Systems
      Qi Zhu (Northwestern University)
      29/09/2026, 14:15
    10. 9. Computing and AI via Molecular Excitations
      Matthew Du (University of Chicago)
      29/09/2026, 15:00
    11. 10. Biological Organoids for Intelligent Systems: The Mind in-Vitro Project
      Mattia Gazzola (University of Illinois at Urbana-Champaign)
      29/09/2026, 15:30
    12. 28. Building the Quantum–HPC Ecosystem: Co-Design Across Hardware, Software, Science, and Industry
      Laura Schulz (Argonne National Laboratory)
      29/09/2026, 16:00
    13. 14. DIscovery Partners Institute: Powering Responsible AI Innovation
      Gene Robinson (University of Illinois at Urbana-Champaign)
      30/09/2026, 09:00
    14. 15. IBM-Illinois Discovery Accelerator Institute
      Klara Nahrstedt (University of Illinois at Urbana-Champaign)
      30/09/2026, 09:30
    15. 16. The FastML Foundation and the Next Phase of Open AI Hardware Innovation
      Philip Coleman Harris (Massachusetts Inst. of Technology (US))
      30/09/2026, 10:00
    16. 26. mHUB: An Innovation Center for All Things HardTech
      Bill Fienup (mHUB)
      30/09/2026, 11:00
    17. 30. Physical AI and Neuromorphic Computation
      Jennifer Hasler (Georgia Institute of Technology)
      30/09/2026, 11:30
    18. 13. Illinois Quantum and Microelectronics Park
      Andrew Lytle (IQMP)
      30/09/2026, 12:00
    19. 18. Quantum Science with Neutral Atom Arrays
      Jake Covey (University of Chicago)
      30/09/2026, 13:45
    20. 19. Neural Atom Quantum Computing at Pasqal
      Heejeong Jeong (Pasqal USA Inc.)
      30/09/2026, 14:05
    21. 20. Adaptive-Window Decoding for Real-Time Quantum Error Correction
      Tina Oberoi (University of Chicago)
      30/09/2026, 14:25
    22. 21. Building Collective Intelligence for Autonomous Discovery at DATAERAI
      Josh Agar (Dataerai)
      30/09/2026, 15:00
    23. 22. AI / Machine Health / Edge Intelligence at BY-AITECH
      Shih-Chieh Hsu (University of Washington Seattle (US))
      30/09/2026, 15:20
    24. 31. Applications of FPGAs to Financial Services and Beyond
      David Lariviere (University of Illinois at Urbana-Champaign)
      30/09/2026, 15:40
    25. 23. Panel: Workforce Development for the AI / Quantum Hardware Era
      30/09/2026, 15:50
    26. 24. Closeout / Next Steps
      30/09/2026, 16:45
    27. 12. Day 2 Overview
      Ahmet Enis Cetin (University of Illinois Chicago)
    28. 32. mHUB: An Innovation Center for All Things HardTech
      Bill Fienup
    29. 11. Panel: Beyond the GPU—What Will the Future AI Compute Stack Look Like?

      Researchers and industry leaders discuss GPUs, FPGAs, ASICs, chiplets, reconfigurable computing, and emerging memory technologies.

      Moderator:

      Panelists;

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    30. 5. Panel: Designing AI Systems Under Real-World Constraints and the AI Innovation Ecosystem

      Discuss important metrics such as latency, throughput, cost, energy, reliability, security, and sustainability as first-class co-design objectives. The role of design tools (including LLMs) and benchmarking to achieve these goals.

      Panelists:

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    31. 17. Panel: What Does Industry Need from the Next Generation of AI Hardware?

      Industry participants outline deployment requirements, technology gaps, and opportunities for collaboration with DPI, FastML, and HLS4ML. How shared tools, benchmarks, reusable IP, and community governance can accelerate innovation while supporting commercialization

      Moderator:

      Panelists:

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    32. 8. Talk