Speaker
Prof.
Mani Tripathi
(University of California Davis (US))
Description
As detectors in HEP require increasingly complex assembly procedures, the availability of a wide variety of interconnect technologies provides more options for overcoming obstacles in generic R&D. I will present recent progress and challenges faced in various interconnect technologies: gold stud and double gold stud bonding, deposition and bonding of indium bumps, solder dispensing and solder ball bonding, and bonding using conductive epoxy. Examples of each technique will be presented and analyzed in the context of ongoing generic R&D. Optimization of procedures, ideal parameters, and expected yields will be presented, keeping in view potential applications for future collider experiments.
| quote your primary experiment | Generic R&D |
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Primary author
Prof.
Mani Tripathi
(University of California Davis (US))
