11-15 February 2013
Vienna University of Technology
Europe/Vienna timezone

Complex Assemblies of Future Silicon Detectors

Not scheduled
Vienna University of Technology

Vienna University of Technology

Gußhausstraße 25-29, 1040 Wien (Vienna), Austria
Board: 66
Poster Semiconductor Detectors


Prof. Mani Tripathi (University of California Davis (US))


As detectors in HEP require increasingly complex assembly procedures, the availability of a wide variety of interconnect technologies provides more options for overcoming obstacles in generic R&D. I will present recent progress and challenges faced in various interconnect technologies: gold stud and double gold stud bonding, deposition and bonding of indium bumps, solder dispensing and solder ball bonding, and bonding using conductive epoxy. Examples of each technique will be presented and analyzed in the context of ongoing generic R&D. Optimization of procedures, ideal parameters, and expected yields will be presented, keeping in view potential applications for future collider experiments.
quote your primary experiment Generic R&D

Primary author

Prof. Mani Tripathi (University of California Davis (US))

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