13th Vienna Conference on Instrumentation - VCI2013

Assembly technology of 4-side buttable MPPC

Not scheduled

50m

Vienna University of Technology

Board: 86

Poster Electronics

Speaker

Mr Koei Yamamoto (HAMAMATSU PHOTONICS K.K.)

Description

Multi-Pixel Photon Counter (MPPC) is solid-state photon counting device using Geiger-mode APD with self-quenching resistor. The features of MPPC are low bias voltage operation, high gain, compactness, robustness and insensitive to magnetic field. A Large-area MPPC is suitable for TOF-PEF and astrophysicists application. We have already developed a monolithic array which is consisted a 4x4 matrix and each pixel size is 3x3 mm2. It has three-sided buttable package and less dead space than a simple discrete MPPC array. It is obtained better performance but still necessary to improve detection efficiency and uniformize characteristics (operation voltage, quenching resistor, sensitivity, timing resolution etc.) of each pixel. We have developed TSV (silicon through via) technology for MPPC, and now we are developing a discrete array of TSV-MPPCs to enhance the fill factor and pixel uniformity. The MPPC chips which have TSV electrodes are accurately mounted on dead-space-less packages by bump bonding and also bumped on substrate with narrow gap. Because the dead space is decreased by eliminating wire-bonding pad, it is possible that the TSV-MPPC arrays are tiled in four-sided buttable. The variation of characteristics between each pixel can be minimized by selected the single MPPCs which have uniform characteristics to the pixel components. This improvement will be effective for high time resolving ability.

Presentation materials

Poster

Assembly_technology_of_4-side_buttable_MPPC.pdf