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Vertex 2012 - The 21st International Workshop on Vertex Detectors

17–21 Sept 2012
Seogwipo KAL Hotel
Asia/Seoul timezone

Session

Session 5 Electronics, Trigger, 3D integration

19 Sept 2012, 09:00
Seogwipo KAL Hotel

Seogwipo KAL Hotel

Jeju, Korea

Conveners

Session 5 Electronics, Trigger, 3D integration

  • Dirk Wiedner (Ruprecht-Karls-Universitaet Heidelberg (DE))

Presentation materials

There are no materials yet.

  1. 30. First Three-Dimensionally Integrated Chip for Photon Science
    Piotr Maj (AGH UST)
    19/09/2012, 09:00
  2. 25. 3D Integration with TSV
    Hans-Guenther Moser (MPI fuer Physik)
    19/09/2012, 09:30
  3. 26. Fast, Granular and Ultra-Light Pixelated Double Sided Ladders Based on CMOS Sensors for an ILC Vertex Detector Adapted to the Ultimate Collision Energy
    Georgios Gerasimos Voutsinas (Institut Pluridisciplinaire Hubert Curien (FR))
    19/09/2012, 10:30
  4. 29. Perspectives of 65nm CMOS Technologies for High Performance Front-End Electronics in Future Applications
    Dr Gianluca Traversi (University of Bergamo)
    19/09/2012, 11:00
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