Vertex 2012 - The 21st International Workshop on Vertex Detectors

Session

Session 5 Electronics, Trigger, 3D integration

19 Sept 2012, 09:00

Seogwipo KAL Hotel

Conveners

Session 5 Electronics, Trigger, 3D integration

• Dirk Wiedner (Ruprecht-Karls-Universitaet Heidelberg (DE))

30. First Three-Dimensionally Integrated Chip for Photon Science

Piotr Maj (AGH UST)

19/09/2012, 09:00

25. 3D Integration with TSV

Hans-Guenther Moser (MPI fuer Physik)

19/09/2012, 09:30

26. Fast, Granular and Ultra-Light Pixelated Double Sided Ladders Based on CMOS Sensors for an ILC Vertex Detector Adapted to the Ultimate Collision Energy

Georgios Gerasimos Voutsinas (Institut Pluridisciplinaire Hubert Curien (FR))

19/09/2012, 10:30

29. Perspectives of 65nm CMOS Technologies for High Performance Front-End Electronics in Future Applications

Dr Gianluca Traversi (University of Bergamo)

19/09/2012, 11:00