Speaker
Kate Doonan
(University of Glasgow (GB))
Description
ATLAS is proposing to replace the entire tracking system for operation at the HL-LHC. This will include a significantly larger pixel detector. This paper reports on the development of large area planar detectors for the outer pixel layers and the pixel endcaps. Large area sensors have been fabricated and mounted onto 4 FE-I4 readout ASICs, so called quad-modules, and their performance evaluated in the laboratory and testbeam. Results from characterisation of sensors prior to assembly and modules in the laboratory and testbeam studies will be presented. A particular challenge in producing thinned large area modules is the bump-bonding, where low yield can be observed due to bowing of the sensor and readout chip during the bonding process. A new bump-bonding process using backside compensation to address the issue of low yield will be presented.
Primary author
Craig Buttar
(University of Glasgow (GB))
Co-authors
Dr
Andrew Blue
(University of Glasgow)
Andrew Stewart
(U)
Corrinne Mills
(University of Edinburgh (GB))
Dean Charles Forshaw
(University of Liverpool (GB))
Georgios Sidiropoulos
(University of Edinburgh (GB))
Gianluigi Casse
(University of Liverpool (GB))
Ilya Tsurin
(University of Liverpool (GB))
John Lipp
(Science and Technology Facilities Council)
John Matheson
(STFC - Rutherford Appleton Lab. (GB))
Joleen Pater
(University of Manchester (GB))
Kate Doonan
(University of Glasgow (GB))
Kenneth Gibb Wraight
(University of Glasgow (GB))
Marko Milovanovic
(University of Liverpool (GB))
Richard Bates
(University of Glasgow (GB))
Sergey Burdin
(University of Liverpool (GB))
Stephan Eisenhardt
(University of Edinburgh (GB))
Thomas Mcmullen
(University of Glasgow (GB))
