8th "Trento" Workshop on Advanced Silicon Radiation Detectors (3D and p-type)

Session

Microfabrication

20 Feb 2013, 09:20

"Stringa" Conference Hall (FBK, Trento)

Conveners

Microfabrication

• Hartmut Sadrozinski (SCIPP)

9. Studies on enhanced silicon detector cooling and integration through microfabrication techniques at CERN

Giulia Romagnoli (Universita e INFN (IT)), Paolo Petagna (CERN)

20/02/2013, 09:20

Ultra-thin liquid micro-fluidic silicon devices have been recently selected for the active thermal management of the GigaTracker detector in the NA62 experiment at CERN. Following this first successful application, further studies have been launched on two-phase flow devices for the upgrades of the ALICE Inner Tracker System (room temperature and low pressure) and LHCb Vertex Locator (low...

27. Silicon Buried Channels for Pixel Detector Cooling

Sabina Ronchin (FBK)

20/02/2013, 09:40

This talk reports the development of an integrated microchannels cooling into silicon devices. The microchannels are formed in silicon using isotropic SF6 plasma etching in a DRIE (deep reactive ion etcher), after the DRIE process the channels are sealed by depositing a PECVD silicon oxide. We have realized on a silicon wafer microchannels with different geometries and hydraulic diameters. We...

11. Microfluidic scintillation detectors for hadron therapy and high energy physics

Pietro Maoddi (CERN)

20/02/2013, 10:00

Within the microScint project in the CERN Physics Department a new generation of microfabricated particle detectors based on liquid scintillators is being developed. These novel devices consist of dense arrays of microfluidic channels acting as optical waveguides and feature high spatial resolution and increased radiation resistance, while minimizing the material budget. Experimental...

14. 3D-S: A fast, high resolution, low-mass, detector with embedded cooling and internal charge multiplication capability

Dr Cinzia Da Via (University of Manchester (GB))

20/02/2013, 10:20

3D silicon sensors have completed the key milestones set by the 3DATLAS R&D collaboration and are now industrially fabricated. A new challenge is now being faced for the HL-LHC which will require a totally new approach in sensor fabrication. 3DS is an innovative fast, low mass modular system where all components, including cooling and active edges, are fabricated and are vertically integrated...

26. A new 3D PIN diode structure for neutron detection

Sabina Ronchin (FBK)

20/02/2013, 10:40

A new hybrid structure of a 3D silicon sensor coupled to a scintillator for the detection of fast and thermal neutrons is presented. The device is based on a PIN diode with DRIE-etched cavities filled with polysiloxane acting as a scintillator, while the signal is transferred to the other side by means of TSV. The structure increases the active interaction volume for neutron, with respect...