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Summary
In future Si strip sensor will face intense radiation environment which causes surface & bulk damage in Si-sensors. In order to explain the double peak feature of the electric field after type-inversion in n-type silicon sensors due to bulk damage, EVL model with two deep level traps is implemented in simulations which are being performed using TCAD simulation package ATLAS (Silvaco).
To compare the simulation results with modeled data for electric field profile, electron/hole concentration, effective bulk doping density, a systematic parametrization study is carried out by varying electron/hole capture cross sections and their ratio, carrier life time, trap introduction rate. Additional bulk current is generated by increasing cross-sections of the trap levels from 1x10-15cm2 to 4x10-14cm2 which results in good agreement between modeled data and simulations for effective substrate concentration, electric field and electron/hole concentration for different fluences. The simulated data also reproduces the double peak feature of electric field at higher values of fluence.