Workshop on CMOS Active Pixel Sensors for Particle Tracking (CPIX14)

Session

3D integration and interconnection technologies

16 Sept 2014, 16:45

Bethe Forum (University of Bonn)

Conveners

3D integration and interconnection technologies

• Jochen Dingfelder (University of Bonn)

24. MAPS are for amateurs, professionals do 3D

Dr Grzegorz Deptuch (Fermi National Accelerator Lab. (US))

16/09/2014, 16:45

27. Advances in Bonding technologies (chip to wafer and wafer to wafer)

Mr Ray Yarema (FNAL)

16/09/2014, 17:15