3D Sensors 2
- Giulio Pellegrini (Centro Nacional de Microelectrónica (IMB-CNM-CSIC) (ES))
Dr Kevin Lauer (CIS Institut fuer Mikrosensorik und Photovoltaik GmbH (DE))
2/19/15, 8:45 AM
In the past, the CiS Forschungsinstitut für Mikrosensorik und Photovoltaik has made a mark as a manufacturer of reliable radiation hard planar silicon sensors for various important high energy particle detectors. Radiation detectors based on 3D structures in silicon are a promising way to increase their radiation hardness. This is especially needed in the high luminosity upgrades of the...
Marta Baselga (IMB-CNM, CSIC)
2/19/15, 9:05 AM
We will present the new ongoing project at CNM-Barcelona, involving the fabrication of new 3D detectors for pixel ATLAS upgrades at the CNM-Barcelona. The mask for the new structures and simulations for the geometries of 50umx50umx200um and 100umx25umx200um will be shown for different irradiations.
43. Development of a new technology for the next generation of 3D Pixel Sensors for HL-LHC within the INFN (ATLAS-CMS) R&D program in collaboration with FBK.
Sabina Ronchin (Fondazione Bruno Kessler)
2/19/15, 9:25 AM
We report on the joint INFN ATLAS-CMS R&D program, in collaboration with FBK, aimed at the development of pixel sensors for the phase 2 upgrade of the LHC (HL-LHC). In this talk we describe the development of the main technological steps allowing for the fabrication of a new generation of Si 3D pixel detectors with small pixel and thin active thickness. In particular, we report on the...
40. Design and TCAD simulation of a new generation of 3D Sensors for HL-LHC within the INFN (ATLAS-CMS) R&D program in collaboration with FBK
Roberto Mendicino (UNITN)
2/19/15, 9:45 AM
We report on the joint INFN ATLAS-CMS R&D program, in collaboration with FBK, aimed at the development of pixel sensors for the phase 2 upgrade of the LHC (HL-LHC). The sensor technology and design will have to be optimized and qualified for extreme radiation hardness, and pixel designs will have to be compatible with present (for testing) and future (65nm) FE chips of ATLAS and CMS. In...
Marco Povoli (University of Oslo)
2/19/15, 10:05 AM
In order to fulfil the requirements of the tracking detectors for the future upgrades of the LHC experiments such as the ITK detector, the 3D community now has to address the challenges of smaller pixels and thinner substrates. The single-sided approach for 3D detectors, which has been developed at SINTEF MiNaLab in collaboration with Stanford Nanofabrication Facility, allows active edges and...
Harris Kagan (O)
2/19/15, 10:25 AM
A prototype of a novel detector using single-crystal chemical vapor deposited diamond and resistive electrodes in the bulk forming a 3D diamond device will be presented. The electrodes of the device were fabricated with laser assisted phase change of diamond into a combination of diamond-like-carbon, amorphous carbon and graphite. The connections to the electrodes of the 3D device were made...