Feb 17 – 19, 2015
FBK, Trento
Europe/Zurich timezone

Design and TCAD simulation of a new generation of 3D Sensors for HL-LHC within the INFN (ATLAS-CMS) R&D program in collaboration with FBK

Feb 19, 2015, 9:45 AM
"Stringa" Conference Hall (FBK, Trento)

"Stringa" Conference Hall

FBK, Trento

Via Sommarive, 18 38123 Povo - Trento ITALY


Roberto Mendicino (UNITN)


We report on the joint INFN ATLAS-CMS R&D program, in collaboration with FBK, aimed at the development of pixel sensors for the phase 2 upgrade of the LHC (HL-LHC). The sensor technology and design will have to be optimized and qualified for extreme radiation hardness, and pixel designs will have to be compatible with present (for testing) and future (65nm) FE chips of ATLAS and CMS. In particular, the talk will focus on a new generation of 3D pixel sensors coping with the high demands of HL-LHC: increased granularity, (e.g., 100$\times$25 or 50$\times$50 $\mu m^2$ pixel size), higher radiation tolerance (up to a fluence of 2x10$^{16}$ n$_{eq} cm^{-2}$), reduced material budget and better geometrical efficiency. Compared to the double-sided 3D sensors successfully produced for the ATLAS IBL, these requirements call for a modified technology allowing for thinner sensors, narrower electrodes, reduced electrode spacing, and very slim (or active) edges. The talk will cover aspects relevant to the design, TCAD simulation and layout of the first batch of these new 3D sensors to be fabricated at FBK on 6” wafers.

Primary author


Mr D M S Sultan (University of Trento, Italy) Gabriele Giacomini (Fondazione Bruno Kessler) Prof. Gian-Franco Dalla Betta (INFN and University of Trento) Maurizio Boscardin (FBK Trento) Nicola Zorzi (Fondazione Bruno Kessler - FBK) Sabina Ronchin (FBK)

Presentation materials