FBK
Author in the following contributions
- Development of a new technology for the next generation of 3D Pixel Sensors for HL-LHC within the INFN (ATLAS-CMS) R&D program in collaboration with FBK.
- Preliminary results from the first batch of Si 3D sensors fabricated at FBK on 6 inch wafers
- Design and TCAD simulation of a new generation of 3D Sensors for HL-LHC within the INFN (ATLAS-CMS) R&D program in collaboration with FBK
