Packaging and interconnects
- Magnus Hansen (CERN)
82. Construction and Test of the First Belle II SVD Ladder Implementing the Origami Chip-on-Sensor Design
Mr Christian Irmler (Austrian Academy of Sciences (AT))
The Belle II Silicon Vertex Detector consists of four layers of double-sided silicon detectors (DSSDs), composed of ladders with two to five sensors each. All sensors are individually read out by APV25 chips with the Origami chip-on-sensor concept for the central DSSDs of the ladders. The chips sit on flexible circuits, which are glued on the top of the sensors. This concept allows for low...