TWEPP 2015 - Topical Workshop on Electronics for Particle Physics

Session

Packaging and interconnects

29 Sept 2015, 11:35

Lisbon

Conveners

Packaging and interconnects

• Magnus Hansen (CERN)

82. Construction and Test of the First Belle II SVD Ladder Implementing the Origami Chip-on-Sensor Design

Mr Christian Irmler (Austrian Academy of Sciences (AT))

29/09/2015, 11:35

Packaging

Oral

The Belle II Silicon Vertex Detector consists of four layers of double-sided silicon detectors (DSSDs), composed of ladders with two to five sensors each. All sensors are individually read out by APV25 chips with the Origami chip-on-sensor concept for the central DSSDs of the ladders. The chips sit on flexible circuits, which are glued on the top of the sensors. This concept allows for low...