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VCI2016 - The 14th Vienna Conference on Instrumentation

15–19 Feb 2016
Vienna University of Technology
Europe/Vienna timezone

Session

Electronics

18 Feb 2016, 11:30
Vienna University of Technology

Vienna University of Technology

Gusshausstraße 27-29, 1040 Wien

Conveners

Electronics

  • Alessandro Marchioro (CERN)

Presentation materials

There are no materials yet.

  1. 212. Testbeam results of the first real time embedded tracking system with artificial retina
    Nicola Neri (Università degli Studi e INFN Milano (IT))
    18/02/2016, 11:30
    Electronics
    Talk
    The retina experiment aims at developing a fast track finding system prototype for the high-luminosity LHC, capable to operate at 40 MHz event rate with hundreds of track per event. According to simulations this is technologically achievable by using the artificial retina algorithm, a massive parallel fast tracking algorithm, implemented in last generation commercial FPGAs. The artificial...
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  2. 108. Electronics Development for the ATLAS Liquid Argon Calorimeter Trigger and Readout for Future LHC Running
    Walter Hopkins (University of Oregon (US))
    18/02/2016, 11:55
    Electronics
    Talk
    The upgrade of the LHC will provide 7 times greater instantaneous and total luminosities than assumed in the original design of the ATLAS Liquid Argon (LAr) Calorimeters. Radiation tolerance criteria and an improved trigger system with higher acceptance rate and longer latency require an upgrade of the LAr readout electronics. In the first upgrade phase in 2019-2020, a trigger readout with up...
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  3. 278. The ALPIDE Pixel Sensor Chip for the Upgrade of the ALICE Inner Tracking System
    Gianluca Aglieri Rinella (CERN)
    18/02/2016, 12:20
    Electronics
    Talk
    The ALPIDE chip is a CMOS Monolithic Active Pixel Sensor being developed for the Upgrade of the Inner Tracking System (ITS) of the ALICE experiment at CERN Large Hadron Collider. ALICE is the first experiment at LHC implementing a large detector with MAPS technology. The ALPIDE chip is implemented with a 180~nm CMOS Imaging Process and fabricated on substrates with a high-resistivity...
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