8-10 June 2016
Asia/Bangkok timezone

The Comparative Effect of Reliability to Integrated Circuit (IC) Package between Conventional Oven Cure and Pressure Oven Cure Process.

Not scheduled
15m
Poster presentation Magnetic and Semiconductor Physics

Speaker

Ms Ameena Noinongyao

Description

This research studied about the efficiency of conventional oven and pressure oven of epoxy curing after die attach process to integrated circuit (IC) packaging reliability. Epoxy curing process is so important to make a completed epoxy due to cross linking to enhance microstructure of epoxy stiffness. This experiment, the samples were tested for two types of non conductive die attach screen print and were cured for conventional oven cure and pressure oven cure. In general process of oven cure to dry epoxy is using a conventional oven but a void can still occur in the layer of epoxy. Therefore, pressure oven cure used for reduction the void that has effect to the reliability of IC package. For analysis, 5x5 mm2 of QFN packages were analyzed by die shear test and were also tested by moisture sensitive level (MSL) to observe void inside the packages. The results showed that the pressure oven cure can be reduced void inside the package and improved IC packaging reliability.

Keywords: Integrated circuit (IC) packaging, Non conductive epoxy, Die attach screen print, Conventinal oven cure, Pressure oven cure

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