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TWEPP-09 Topical Workshop on Electronics for Particle Physics

21–25 Sept 2009
Institut des Cordeliers 15, rue de l'Ecole de Médecine (Métro Odéon) Paris, France
Europe/Paris timezone
<strong>The deadline for paper submission has been extended to 23 October 2009</strong>

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Session

Parallel session B2b - Radiation tolerant components and systems

B2b
22 Sept 2009, 16:40
Institut des Cordeliers 15, rue de l'Ecole de Médecine (Métro Odéon) Paris, France

Institut des Cordeliers 15, rue de l'Ecole de Médecine (Métro Odéon) Paris, France

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  1. 124. Measurement of radiation damage of 130nm hybrid pixel detector readout chips
    Dr Richard Plackett (CERN)
    22/09/2009, 16:40
    Radiation tolerant components and systems
    Oral
    We present the first measurements of the performance of the Medipix3 hybrid pixel readout chip after exposure to significant x-ray flux. Specifically the changes in performance of the mixed mode pixel architecture, the digital periphery, digital to analogue converters and the e-fuse technology were characterised. A high intensity, calibrated x-ray source was used to incrementally irradiate...
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  2. 126. Radiation tests on the complete system of the instrumentation of the LHC Cryogenics at the CERN Neutrinos to Gran Sasso (CNGS) test facility
    Ms Evangelina GOUSIOU (CERN)
    22/09/2009, 17:05
    Radiation tolerant components and systems
    Oral
    There are more than 6000 electronic cards for the instrumentation of the LHC cryogenics, housed in crates and distributed around the 27km tunnel. Cards and crates will be exposed to a complex radiation field during the 10y of LHC operation. COTS and rad-tol ASIC have been selected and individually qualified during the design phase of the cards. The test setup and the acquired data presented in...
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  3. 133. Development of new readout electronics for the ATLAS LAr calorimeter at the sLHC
    Arno Straessner (IKTP, TU Dresden)
    22/09/2009, 17:30
    Radiation tolerant components and systems
    Oral
    The ATLAS Liquid Argon (LAr) calorimeter consists of 182,486 detector cells whose signals need to be read out, digitized and processed, in order to provide signal timing and the energy deposited in each detector element. The current readout electronics is not designed to sustain the ten times higher radiation levels expected at sLHC in the years ≥2017, and will be replaced by new electronics...
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